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FDZ3N513ZT PDF预览

FDZ3N513ZT

更新时间: 2024-11-25 12:23:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 肖特基二极管
页数 文件大小 规格书
7页 349K
描述
Integrated NMOS and Schottky Diode

FDZ3N513ZT 数据手册

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July 2010  
FDZ3N513ZT  
Integrated NMOS and Schottky Diode  
Features  
General Description  
The FDZ3N513ZT is a monolithic NMOS/ Schottky combination  
(FETky) and is designed and wired to function as a discontinu-  
ous conduction mode (DCM) boost LED power train for mobile  
LED backlighting applications.  
„ Monolithic NMOS and Schottky Diode  
„ Ultra-small form factor 1mm x 1mm WLCSP  
„ Max rDS(on) = 462 mΩ at VGS = 4.5 V, ID = 0.3 A  
„ Max rDS(on) = 520 mΩ at VGS = 3.2 V, ID = 0.3 A  
„ HBM ESD protection level > 2000V (Note3)  
„ RoHS Compliant  
Application  
„ Boost Converter Power Train for single cell Li-ion LED  
backlighting  
D
K
S
G
Pin 1  
WL-CSP 1.0X1.0 Bumps Facing Up View  
WL-CSP 3D Bumps Facing Down View  
WL-CSP 3D Bumps Facing Up View  
Absolute Maximum Ratings  
Symbol  
Parameter  
Ratings  
30  
Units  
VDS  
VGS  
PD  
NMOS Drain to Source Voltage  
NMOS Gate to Source Voltage  
Power Dissipation @ TA = 25°C  
V
V
-0.3/5.5  
1
(Note 1a)  
(Note 1a)  
W
A
ID  
Maximum Continuous NMOS Drain Current  
Schottky Repetitive Peak Reverse Voltage  
Schottky Average Forward Current  
1.1  
VRRM  
IO  
25  
V
0.3  
A
TJ, TSTG Operating Junction and Storage Temperature  
ESD Electrostatic Discharge Protection  
-55/125  
2000  
°C  
V
CDM  
Thermal Characteristics  
RθJA  
RθJA  
Thermal Resistance, Junction to Ambient - 1in2, 2oz. Copper  
(Note 1a)  
(Note 1b)  
100  
260  
°C/W  
°C/W  
Thermal Resistance, Junction to Ambient - Minimum Pad  
Package Marking and Ordering Information  
Part Number  
Device Marking  
Package  
Reel Size  
7”  
Tape Width  
8mm  
Quantity  
FDZ3N513ZT  
Z3  
WL-CSP 1.0X1.0  
5000 units  
©2010 Fairchild Semiconductor Corporation  
FDZ3N513ZT Rev. C  
www.fairchildsemi.com  
1

FDZ3N513ZT 替代型号

型号 品牌 替代类型 描述 数据表
FDZ3N513ZT ONSEMI

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