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FDZ2553N PDF预览

FDZ2553N

更新时间: 2024-11-05 22:31:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
6页 198K
描述
Monolithic Common Drain N-Channel 2.5V Specified PowerTrench

FDZ2553N 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:GRID ARRAY, R-PBGA-B18
针数:18Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.3
Is Samacsys:N配置:COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):9.6 A
最大漏极电流 (ID):9.6 A最大漏源导通电阻:0.014 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PBGA-B18
JESD-609代码:e0湿度敏感等级:1
元件数量:2端子数量:18
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.1 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDZ2553N 数据手册

 浏览型号FDZ2553N的Datasheet PDF文件第2页浏览型号FDZ2553N的Datasheet PDF文件第3页浏览型号FDZ2553N的Datasheet PDF文件第4页浏览型号FDZ2553N的Datasheet PDF文件第5页浏览型号FDZ2553N的Datasheet PDF文件第6页 
February 2003  
FDZ2553N  
Monolithic Common Drain N-Channel 2.5V Specified PowerTrench BGA MOSFET  
General Description  
Features  
Combining Fairchild’s advanced 2.5V specified  
PowerTrench process with state-of-the-art BGA  
packaging, the FDZ2553N minimizes both PCB space  
9.6 A, 20 V.  
RDS(ON) = 14 m@ VGS = 4.5 V  
RDS(ON) = 20 m@ VGS = 2.5 V  
and RDS(ON)  
MOSFET embodies  
technology which enables the device to combine  
excellent thermal transfer characteristics, high current  
handling capability, ultra-low profile packaging, low gate  
.
This Monolithic Common Drain BGA  
breakthrough in packaging  
Occupies only 0.10 cm2 of PCB area:  
1/3 the area of SO-8.  
a
Ultra-thin package: less than 0.80 mm height when  
mounted to PCB.  
charge, and low RDS(ON)  
.
Applications  
Outstanding thermal transfer characteristics:  
Battery management  
Load switch  
significantly better than SO-8.  
Ultra-low Qg x RDS(ON) figure-of-merit  
Battery protection  
High power and current handling capability  
S
D
S
D
S
S
S
D
S
S
S
Pin 1  
G
Q2  
Q1  
Q1  
G
S
D
G
D
S
D
S
D
Q2  
Pin 1  
G
Top  
Bottom  
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
20  
±12  
V
V
A
VGSS  
ID  
Gate-Source Voltage  
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
(Note 1a)  
9.6  
20  
2.1  
PD  
Power Dissipation (Steady State)  
W
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
°C  
Thermal Characteristics  
RθJA  
RθJB  
RθJC  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
(Note 1)  
60  
6.3  
0.6  
°C/W  
Thermal Resistance, Junction-to-Ball  
Thermal Resistance, Junction-to-Case  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
2553N  
FDZ2553N  
7’’  
12mm  
3000 units  
2003 Fairchild Semiconductor Corporation  
FDZ2553N Rev D2 (W)  

FDZ2553N 替代型号

型号 品牌 替代类型 描述 数据表
FDZ2551N FAIRCHILD

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