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FDWS9509L-F085 PDF预览

FDWS9509L-F085

更新时间: 2024-11-20 11:13:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 361K
描述
P 沟道,逻辑电平,Power Trench® MOSFET,-40V,-65A,8mΩ

FDWS9509L-F085 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – P-Channel,  
Logic Level, POWERTRENCH)  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
40 V  
8.0 mW @ 10 V  
65 A  
-40 V, -65 A, 8.0 mW  
D
FDWS9509L-F085  
Features  
G
Typ R  
Typ Q  
= 6.3 mW at V = 10 V; I = 65 A  
GS D  
DS(on)  
= 48 nC at V = 10 V; I = 65 A  
g(tot)  
GS  
D
S
UIS Capability  
PChannel MOSFET  
Wettable Flanks for Automatic Optical Inspection (AOI)  
AECQ101 Qualified and PPAP Capable  
Bottom  
Top  
D
This Device is PbFree, Halogen Free/BFR Free and is RoHS  
D
D
D
Compliant  
G
Applications  
S
S
S
Pin 1  
Automotive Engine Control  
PowerTrain Management  
Solenoid and Motor Drivers  
Electronic Steering  
Integrated Starter/Alternator  
Distributed Power Architectures and VRM  
Primary Switch for 12 V Systems  
DFNW8  
CASE 507AU  
MARKING DIAGRAM  
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
ON  
AYWWWL  
FDWS  
9509L  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
16  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
V
Continuous Drain Current  
GS  
T
T
= 25°C  
= 25°C  
I
D
65  
A
C
(V = 10 V) (Note 1)  
A
Y
= Assembly Location  
= Year  
Pulsed Drain Current  
See  
Figure 4  
C
WW  
WL  
= Work Week  
= Assembly Lot  
Single Pulse Avalanche Energy (Note 2)  
Power Dissipation  
E
84  
mJ  
W
AS  
FDWS9509L = Specific Device Code  
P
107  
0.71  
D
Derate above 25°C  
W/°C  
°C  
ORDERING INFORMATION  
Operating and Storage Temperature  
T , T  
55 to  
+175  
J
STG  
Device  
Package  
Shipping  
Thermal Resistance (JunctiontoCase)  
R
1.4  
50  
°C/W  
°C/W  
DFNW8  
(Power 56)  
(PbFree)  
q
JC  
JA  
FDWS9509LF085  
3000 /  
Tape & Reel  
Maximum Thermal Resistance  
(JunctiontoAmbient) (Note 3)  
R
q
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Current is limited by wirebond configuration.  
2. Starting Tj = 25°C, L = 50 mH, I = 56 A, V = 40 V during inductor charging  
AS  
DD  
and V = 0 V during time in avalanche.  
DD  
3. R  
is the sum of the junctiontocase and casetoambient thermal  
q
JA  
resistance where the case thermal reference is defined as the solder  
mounting surface of the drain pins. R  
is guaranteed by design while R  
q
JA  
q
JC  
is determined by the user’s board design. The maximum rating presented  
2
here is based on mounting on a 1 in pad of 2 oz copper.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
October, 2021 Rev. 2  
FDWS9509LF085/D  
 

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