DATA SHEET
www.onsemi.com
MOSFET – P-Channel, Logic
Level, POWERTRENCH)
V
DSS
R
MAX
I MAX
D
DS(ON)
−40 V
4.9 mW @ −10 V
−80 A
-40 V, -80 A, 4.9 mW
S
FDWS9508L-F085
Features
G
• Typ R
• Typ Q
= 3,6 mW at V = −10 V; I = −80 A
GS D
DS(on)
= 82 nC at V = −10 V; I = −80 A
g(tot)
GS
D
• UIS Capability
• Wettable Flanks for Automatic Optical Inspection (AOI)
• AEC−Q101 Qualified
D
P−Channel MOSFET
• These Devices are Pb−Free and are RoHS Compliant
Applications
Top
Bottom
D
• Automotive Engine Control
• PowerTrain Management
• Solenoid and Motor Drivers
• Electrical Power Steering
• Integrated Starter/Alternator
• Distributed Power Architectures and VRM
• Primary Switch for 12 V Systems
D
D
D
G
S
S
S
Pin 1
DFNW8
CASE 507AU
MOSFET MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)
MARKING DIAGRAM
J
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Ratings
−40
Unit
V
V
DSS
V
GS
16
V
ON
AYWWWL
FDWS
9508L
I
D
Drain Current (T = 25°C)
A
C
Continuous (V = −10 V) (Note 1)
−80
(see Fig. 4)
GS
Pulsed
E
AS
Single Pulse Avalanche Energy
(Note 2)
211
mJ
A
Y
= Assembly Location
= Year
= Work Week
= Assembly Lot
= Device Code
= Device Code
P
Power Dissipation
214
W
D
Derate Above 25°C
1.43
W/°C
WW
WL
FDWS
9508L
T , T
Operating and Storage Temperature
−55 to +175
°C
J
STG
R
Thermal Resistance
(Junction to case)
0.7
°C/W
θ
JC
(Note: Microdot may be in either location)
R
Maximum Thermal Resistance
(Junction to Ambient) (Note 3)
50
°C/W
θ
JA
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Current is limited by wirebond configuration
ORDERING INFORMATION
†
Device
Package
Shipping
2. Starting Tj = 25°C, L = 0.1 mH, I = −65 A, V
= −40 V during inductor
FDWS9508L−F085
DFNW8
(Power56)
(Pb−Free)
3000 /
Tape & Reel
AS
DD
charging and V = 0 V during time in avalanche
DD
3. R
is the sum of the junction−to−case and case−to−ambient thermal
q
JA
resistance where the case thermal reference is defined as the solder
mounting surface of the drain pins. R
is guaranteed by design while R
q
JA
q
JC
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
is determined by the user’s board design. The maximum rating presented
2
here is based on mounting on a 1 in pad of 2 oz copper.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
October, 2021 − Rev. 3
FDWS9508L−F085/D