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FDS8949 PDF预览

FDS8949

更新时间: 2024-09-14 17:15:35
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
7页 712K
描述
种类:N+N-Channel;漏源电压(Vdss):40V;持续漏极电流(Id)(在25°C时):6A;Vgs(th)(V):±20;漏源导通电阻:29mΩ@10V

FDS8949 数据手册

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R
FDS8949  
UMW  
40V Dual N-Channel MOSFET  
General Description  
These N-channel Logic Level MOSFETS has been  
especially tailoredto minimize the on-state resis-  
tance and yet maintainsuperior switching  
performancehese devices are well suited for low  
voltage andbattery powered applications where low  
in-line poweross and fast switching are required  
Features  
VDS (V) = 40V  
(VGS = 10V)  
29m  
ID = 6A  
RDS(ON)  
RDS(ON) <  
Ω(V  
GS  
=10V)  
36m  
Ω(V  
GS  
=4.5V)  
Low gate charge  
RoHS compliant  
High performance trench technology for extremely low RDS(ON)  
High power and current handling capability  
Applications  
Inverter  
Power suppliers  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
40  
V
V
±20  
(Note 1a)  
(Note 3)  
6
ID  
A
20  
EAS  
Drain-Source Avalanche Energy  
26  
mJ  
Power Dissipation for Dual Operation  
Power Dissipation for Single Operation  
2
1.6  
PD  
W
(Note 1a)  
(Note 1b)  
0.9  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
RθJA  
RθJA  
RθJC  
Thermal Resistance-Single operation, Junction to Ambient  
(Note 1a)  
81  
135  
40  
Thermal Resistance-Single operation, Junction to Ambient (Note 1b)  
°C/W  
Thermal Resistance, Junction to Case  
(Note 1)  
www.umw-ic.com  
UTD Semiconductor Co.,Limited  
1

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