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FDMS86500 PDF预览

FDMS86500

更新时间: 2024-09-25 13:07:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管开关脉冲光电二极管PC
页数 文件大小 规格书
2页 1163K
描述
Power Field-Effect Transistor, 28.5A I(D), 60V, 0.0019ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-240AA, ROHS COMPLIANT, POWER 56, 8 PIN

FDMS86500 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, POWER 56, 8 PINReach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.82
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):49 A
最大漏极电流 (ID):28.5 A最大漏源导通电阻:0.0019 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MO-240AA
JESD-30 代码:R-PDSO-F5元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):104 W最大脉冲漏极电流 (IDM):180 A
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMS86500 数据手册

 浏览型号FDMS86500的Datasheet PDF文件第2页 
DUAL COOLPACKAGE POWERTRENCH® MOSFETs  
Dual Coolpackaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is  
the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual  
path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with  
Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink  
is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and  
increased power density. With Fairchilds trench silicon technology, Dual Cool packaging technology proves to be a  
clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS  
compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.  
Features  
•ꢀ Top-side cooling, lower thermal resistance from  
Bottom  
Top  
junction to top  
3.3 mm x 3.3 mm  
&
5 mm x 6 mm  
•ꢀ Same land pattern as 5 mm x 6 mm and  
3.3 mm x 3.3 mm PQFN – JEDEC standard  
•ꢀ Allows higher current and power dissipation  
•ꢀ Highest power density for DC-DC applications  
•ꢀ Use with or without a heat sink, reduces the  
number of qualified components in the BOM  
Maximum Power Dissipation  
•ꢀ Multiple suppliers without cross licensing  
Capable of >60% Better Thermal Performance  
requirements  
•ꢀ High degree of production commonality with  
Dual Cool Package  
standard PQFN packaging  
3.3mm x 3.3mm  
Air Flow =  
200LFM  
•ꢀ 25 V - 150 V portfolio  
Standard PQFN  
No Air Flow  
3.3mm x 3.3mm  
Applications  
•ꢀ Point-of-load (POL) synchronous-buck conversion  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
•ꢀ Servers  
Power Loss (W) TJ Max. = 90°C, Ta=50°C  
•ꢀ Telecommunications, routing and switching  
•ꢀ Heat path from top only  
5mm x 6mm Package  
QJA(°C/W)  
(%) Improvement from Wire Package  
Interconnect  
PQFN Wire  
PQFN Clip  
27.1  
23.8  
17.2  
-
13.9  
57.5  
Dual Cool Package  
Environment: Minimum Pad, Heat Sink, 200LFM Forced Air  
fairchildsemi.com  

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