DATA SHEET
www.onsemi.com
MOSFET – N-Channel,
POWERTRENCH)
V
R
MAX
I MAX
D
DSS
DS(ON)
80 V
7.5 mW @ 10 V
65 A
80 V, 65 A, 7.5 mW
ELECTRICAL CONNECTION
FDMS86369-F085
Features
• Typ R
• Typ Q
= 5.9 mW at V = 10 V; I = 65 A
GS D
DS(on)
= 35 nC at V = 10 V; I = 65 A
g(tot)
GS
D
• UIS Capability
• AEC−Q101 Qualified and PPAP Capable
• This Device is Pb−Free, Halogen Free/BFR Free and is RoHS
Compliant
N−Channel MOSFET
Bottom
Top
D
D
Applications
D
D
• Automotive Engine Control
• PowerTrain Management
• Solenoid and Motor Drivers
• Integrated Starter/Alternator
• Primary Switch for 12 V Systems
G
S
S
S
Pin 1
DFNW8
CASE 507AU
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING DIAGRAM
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
Gate−to−Source Voltage
V
20
V
GS
ON
AYWWWL
FDMS
86369
Continuous Drain Current
T
T
= 25°C
= 25°C
I
65
A
C
D
(V = 10 V) (Note 1)
GS
Pulsed Drain Current
See
Figure 4
C
Single Pulse Avalanche Energy (Note 2)
Power Dissipation
E
27
mJ
W
AS
A
Y
WW
WL
= Assembly Location
= Year
= Work Week
= Assembly Lot
P
107
0.71
D
Derate above 25°C
W/°C
°C
FDMS86369 = Specific Device Code
Operating and Storage Temperature
T , T
−55 to
+175
J
STG
Thermal Resistance (Junction−to−Case)
R
1.4
50
°C/W
°C/W
q
JC
JA
ORDERING INFORMATION
Maximum Thermal Resistance
(Junction−to−Ambient) (Note 3)
R
q
†
Device
Package
Shipping
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Current is limited by bondwire configuration.
DFNW8
(Power 56)
(Pb−Free)
FDMS86369−F085
3000 /
Tape & Reel
2. Starting Tj = 25°C, L = 20 mH, I = 52 A, V = 80 V during inductor charging
AS
DD
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
and V = 0 V during time in avalanche.
DD
3. R
is the sum of the junction−to−case and case−to−ambient thermal
q
JA
resistance where the case thermal reference is defined as the solder
mounting surface of the drain pins. R
is guaranteed by design while R
q
JA
q
JC
is determined by the user’s board design. The maximum rating presented
2
here is based on mounting on a 1 in pad of 2 oz copper.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
October, 2021 − Rev. 4
FDMS86369−F085/D