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FDD86367 PDF预览

FDD86367

更新时间: 2024-10-03 11:13:39
品牌 Logo 应用领域
安森美 - ONSEMI 开关晶体管
页数 文件大小 规格书
7页 441K
描述
N 沟道 PowerTrench® MOSFET 80 V,100 A,4.2 mΩ

FDD86367 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:not_compliant
Factory Lead Time:26 weeks风险等级:5.74
雪崩能效等级(Eas):82 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:80 V
最大漏极电流 (Abs) (ID):100 A最大漏极电流 (ID):100 A
最大漏源导通电阻:0.0042 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):227 W表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):80 ns最大开启时间(吨):104 ns
Base Number Matches:1

FDD86367 数据手册

 浏览型号FDD86367的Datasheet PDF文件第2页浏览型号FDD86367的Datasheet PDF文件第3页浏览型号FDD86367的Datasheet PDF文件第4页浏览型号FDD86367的Datasheet PDF文件第5页浏览型号FDD86367的Datasheet PDF文件第6页浏览型号FDD86367的Datasheet PDF文件第7页 
MOSFET – N-Channel,  
POWERTRENCH)  
80 V, 100 A, 4.2 mW  
FDD86367  
Features  
www.onsemi.com  
Typical R  
Typical Q  
= 3.3 mW at V = 10 V, I = 80 A  
GS D  
DS(on)  
= 68 nC at V = 10 V, I = 80 A  
g(tot)  
GS  
D
D
UIS Capability  
This Device is PbFree, Halogen Free/BFR Free and is RoHS  
Compliant  
G
Applications  
PowerTrain Management  
Solenoid and Motor Drivers  
Integrated Starter/Alternator  
Primary Switch for 12 V Systems  
S
NChannel  
D
G
MOSFET MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Symbol  
VDSS  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Ratings  
80  
Unit  
V
S
DPAK3 (TO252 3 LD)  
VGS  
20  
V
CASE 369AS  
I
D
Drain Current Continuous (V = 10)  
100  
A
GS  
(Note 1)  
T
= 25°C  
MARKING DIAGRAM  
C
Pulsed Drain Current  
T
= 25°C See Figure 4  
C
EAS  
Single Pulse Avalanche Energy (Note 2)  
Power Dissipation  
82  
227  
mJ  
W
$Y&Z&3&K  
FDD  
P
D
86367  
Derate Above 25°C  
1.52  
W/°C  
°C  
T , T  
Operating and Storage Temperature  
Thermal Resistance, Junction to Case  
55 to + 175  
0.66  
J
STG  
FDD86367 = Specific Device Code  
R
°C/W  
°C/W  
q
q
JC  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= 3Digit Date Code  
R
Maximum Thermal Resistance,  
Junction to Ambient (Note 3)  
52  
JA  
= 2Digits Lot Run Traceability Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Current is limited by bondwire configuration.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
2. Starting T = 25°C, L = 40 mH, I = 64 A, V = 80 V during inductor charging  
J
AS  
DD  
and V = 0V during time in avalanche.  
DD  
3. R  
is the sum of the junctiontocase and casetoambient thermal  
q
JA  
resistance, where the case thermal reference is defined as the solder  
mounting surface of the drain pins. R  
is guaranteed by design, while R  
q
JA  
qJC  
is determined by the board design. The maximum rating presented here is  
2
based on mounting on a 1 in pad of 2oz copper.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
August, 2020 Rev. 2  
FDD86367/D  
 

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