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FDD7N20TF PDF预览

FDD7N20TF

更新时间: 2024-11-06 03:28:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 343K
描述
N-Channel MOSFET

FDD7N20TF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-252AA
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.83Is Samacsys:N
雪崩能效等级(Eas):62.5 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):5 A最大漏极电流 (ID):5 A
最大漏源导通电阻:0.69 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):43 W
最大脉冲漏极电流 (IDM):15 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDD7N20TF 数据手册

 浏览型号FDD7N20TF的Datasheet PDF文件第2页浏览型号FDD7N20TF的Datasheet PDF文件第3页浏览型号FDD7N20TF的Datasheet PDF文件第4页浏览型号FDD7N20TF的Datasheet PDF文件第5页浏览型号FDD7N20TF的Datasheet PDF文件第6页浏览型号FDD7N20TF的Datasheet PDF文件第7页 
April 2007  
TM  
UniFET  
FDD7N20 / FDU7N20  
tm  
N-Channel MOSFET  
200V, 5A, 0.69Ω  
Features  
Description  
RDS(on) = 0.58Ω ( Typ. ) @ VGS = 10V, ID = 2.5A  
Low gate charge( Typ. 5nC )  
Low Crss ( Typ. 5pF )  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especically tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
D
D
G
G
I-PAK  
FDU Series  
S
G
S
D-PAK  
FDD Series  
D
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
200  
V
V
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- P uls ed  
5
ID  
D r a in C u r r e n t  
A
3
IDM  
D rai n Cur rent  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
15  
62.5  
5
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.3  
mJ  
V/ns  
W
W/oC  
oC  
4.5  
(TC = 25oC)  
- Derate above 25oC  
43  
PD  
Power Dissipation  
0.34  
-55 to +150  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Ratings  
2.9  
Units  
RθJC  
RθJA  
oC/W  
110  
©2007 Fairchild Semiconductor Corporation  
FDD7N20 / FDU7N20 Rev. A  
1
www.fairchildsemi.com  

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