www.fujielectric.com/products/semiconductor/
SiC-SBD
FDC2AT08S65
SiC Schottky Barrier Diode
Features
Internal circuit chart
• New 2nd Generation Technology
• Low forward voltage
• High surge current capability
• High speed switching
• Pb-free lead terminal; RoHS compliant
• Halogen-free molding compound
Cathode ①
Anode ②
①
②
Applications
• Switch mode power supply
• Uninterruptible power supply
• PV Power Conditioner
TO-220F-2
Maximum Ratings and Characteristics
Absolute Maximum Ratings at Tvj = 25°C(unless otherwise specified)
Parameter
Symbol
Value
650
Unit
V
Remarks
Repetitive peak reverse voltage
Continuous forward current
V
RRM
IF
8
A
Tc
Tc
Tc
Tc
Tc
Tc
< 124 °C, D = 1
68.0
51.0
23.1
13.0
50
A
= 25 °C, t
= 150 °C, t
= 25 °C, t = 10 ms
= 10 ms
p
= 10 ms
Surge non-repetitive forward current
(half sine wave)
I
FSM
A
p
= 10 ms
A2s
A2s
W
p
I2t value
∫I2dt
= 150 °C, t
p
Max. Power Dissipation
Operating junction temperature
Storage temperature
P
tot
= 25 °C
Tvj
175
°C
T
stg
-55 ~ +175
2
°C
Isolation Voltage
V
iso
kVrms
t = 60sec, f = 60Hz
Electrical Characteristics at Tvj = 25°C(unless otherwise specified)
Static characteristics
Parameter
Symbol
Conditions
Min.
Typ.
-
Max.
-
Unit
V
DC blocking voltage
V
V
DC
I
I
I
R
F
F
= 1 mA
650
= 8A, Tvj = 25 °C
1.10
1.30
1.48
0.28
1.5
1.50
1.99
40
V
Forward voltage
Reverse current
F
= 8 A, Tvj = 150 °C
-
-
-
V
V
R
= 650 V, Tvj = 25 °C
= 650 V, Tvj = 150 °C
μA
μA
IR
V
R
160
Dynamic characteristics
Parameter
Symbol
Conditions
Min.
Typ.
7.9
Max.
Unit
nC
V
R
= 400 V, I = 8 A,
F
Total Capacitive Charge
Total Capacitance
Q
C
-di/dt = 200 A/μs,
vj = 150 °C
-
-
-
-
T
C
V
R
= 400 V, f = 1 MHz
37
pF
Thermal Resistance
Parameter
Symbol
Min.
Typ.
Max.
58
Unit
°C/W
°C/W
Thermal Resistance, Junction –Ambient
Thermal Resistance, Junction –Case
R
th(j-a)
-
-
-
-
Rth(j-c)
2.98
4442
JUNE 2022
1