F-210 SUPPLEMENT
FCT–120–03–L–D–01–RA–SL
EMT–130–01–S–D
(2,00mm) .0787"
FCT, EMT SERIES
™
FLEXCARD TERMINAL & SOCKET STRIPS
Mates with:
NO. PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
CARD
SLOT
TAIL
OPTION
EMT
1
D
SL
FCT
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FCT
Specify
LEAD
STYLE
from
–01
= Accepts
(0,80mm)
.031"
–F
Insulator Material:
Black Liquid Crystal
Polymer
–RA
20, 30 & 40
= Gold flash on post,
Matte Tin on tail
= Right Angle
(Call Samtec for other sizes)
thick card
chart
(Leave blank for
vertical version.
Style –02 only)
Terminal Material:
Phosphor Bronze
Current Rating:
3A @ 80°C ambient
Operating Temp Range:
-55°C to +105°C with Tin;
-55°C to +125°C with Gold
Plating:
Sn or Au over 50µ"
(1,27µm) Ni
RoHS Compliant:
Yes
–L
= 10µ" (0,25µm) Gold on post,
Matte Tin on tail
No. of positions x (2,00) .0787 + (18,19) .716
No. of positions x (2,00) .0787
+ (13,87) .546
LEAD
STYLE
–02
CARD-TO-BOARD
SPACE (X)
Y
–S
(6,35) .250
(2,60) .1025
= 30µ" (0,76µm) Gold on post,
Matte Tin on tail
–03
(9,53) .375
(5,78) .2275
(1,14)
.045
(2,00)
.0787
(3,20) .126
(2,00)
.0787
(44,45)
1.750
Processing:
Max Processing Temp:
230°C for 60 seconds or
260°C for 20 seconds 3x
with Matte Sn plating
Lead–Free Solderable:
Wave, or reflow with
Matte Sn plating
(2,29)
.090
(38,10) 1.500
(1,52)
.060
TYP
(2,29)
.090
Y
Y
X
X
(2,54)
.100
DIA
(3,81) .150
Note: Some lengths,
Style –02
(2,00) .0787
styles and options are
Style –03
TYP
–RA OPTION
non-standard, non-returnable.
SPECIFICATIONS
NO. PINS
PER ROW
CARD
THICKNESS
PLATING
OPTION
For complete specifications and
recommended PCB layouts
see www.samtec.com?EMT
EMT
1
D
Insulator Material:
–01
Black LCP
Mates with: FCT
Contact Material: BeCu
Current Rating:
= (0,80mm) .031"
thick board
Note: Some lengths,
styles and options are
3A @ 80°C ambient
(Low Insertion Force)
–L
non-standard, non-returnable.
Operating Temp Range:
-55°C to +125°C
20, 30, 40
= 10µ" (0,25µm)
Gold on contact,
Matte on tail
(Call Samtec for other sizes)
Plating: Sn or Au over
50µ" (1,27µm) Ni
–51
™
= (0,80mm) .031"
thick board
Contact Resistance:
10 mΩ max
No. of positions x (2,00) .0787
(Standard
Insertion Force)
Insertion Depth: (3,05mm)
.120" to (3,30mm) .130"
Insertion Force:
–S
+ (3,56) .140
= 30µ" (0,76µm)
Gold on contact,
Matte Tin on tail
(4,00)
.158
-01=1.5oz (0,44N) average
-51=2.5oz (0,70N) average
Withdrawal Force:
(2,00)
.0787
(2,00)
.0787
(2,08)
.082
-01=1.1oz (0,31N) average
-51=1.5oz (0,44N) average
Max Processing Temp:
230°C for 60 seconds or
260°C for 20 seconds 3x
with Matte Sn plating
Lead–Free Solderable:
Yes, with Matte Sn plating
SMT Lead Coplanarity:
(0,10mm) .004" max (20)
(0,15mm) .006" max (30-40)
RoHS Compliant: Yes
(2,74)
.108
(3,56)
.140
(5,46)
.215
(0,81)
.032
(0,51)
.020
WWW.SAMTEC.COM