May 2013
FCH47N60
N-Channel SuperFET MOSFET
®
600 V, 47 A, 70 m
Features
Description
•
•
•
•
•
•
650 V atTJ = 150°C
The FCH47N60 SuperFET® MOSFET is Fairchild Semiconduc-
tor’s first generation of high-voltage super-junction (SJ) MOSFET
family that utilizes charge-balance technology for outstanding
low on-resistance and lower gate charge performance. This tech-
nology is tailored to minimize conduction loss and provide supe-
rior switching performance, dv/dt rate, and avalanche energy.
This SuperFET MOSFET is suitable for the switching power
applications such as PFC, server/telecom power, FPD TV power,
ATX power, and industrial power.
Typ. RDS(on) = 58 m
Ultra-Low Gate Charge (Typ. Qg = 210 nC)
Low Effective Output Capacitance (Typ. Cosseff. = 420 pF)
100% Avalanche Tested
RoHS Compliant
Applications
•
Solar Inverter
•
AC-DC Power Supply
D
G
TO-247
G
D
S
S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted*
Symbol
VDSS
Parameter
FCH47N60_F133
Unit
Drain to Source Voltage
Drain Current
600
47
V
Continuous (TC = 25°C)
Continuous (TC = 100°C)
Pulsed
ID
A
29.7
141
IDM
Drain Current
(Note 1)
A
V
VGSS
EAS
IAR
Gate to Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
±30
(Note 2)
(Note 1)
(Note 1)
(Note 3)
1800
47
mJ
A
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
41.7
4.5
mJ
V/ns
W
(TC = 25°C)
417
PD
Power Dissipation
Derate above 25°C
3.33
-55 to +150
W/°C
°C
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
°C
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
RJC
Parameter
Typ.
Max.
Unit
°C/W
°C/W
°C/W
Thermal Resistance, Junction to Case, Maximum
Thermal Resistance, Case-to-Sink
0.3
RJA
RJA
0.24
Thermal Resistance, Junction to Ambient, Maximum
41.7
©2009 Fairchild Semiconductor Corporation
FCH47N60 Rev. C1
1
www.fairchildsemi.com