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FBGA PDF预览

FBGA

更新时间: 2024-11-09 03:36:11
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STATSCHIP
页数 文件大小 规格书
2页 559K
描述
Fine Pitch Ball Grid Array

FBGA 数据手册

 浏览型号FBGA的Datasheet PDF文件第2页 
FBGA  
Fine Pitch Ball Grid Array  
Array molded, cost effective, space  
saving package solution  
Available in 1.40mm (LFBGA),  
1.20mm (TFBGA), and 1.00mm  
(VFBGA), 0.80mm (WFBGA) and  
0.55mm (UFBGA) maximum  
thickness  
Laminate substrate based package  
which enables 2 and 4 layers of  
routing flexibility  
FEATURES  
DESCRIPTION  
Thin, lightweight, space saving package  
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a  
laminate substrate based chip scale package with plastic  
overmolded encapsulation and an array of fine pitch solder  
ball terminals. The FBGA packages reduced outline and  
thickness and higher density options make it an ideal  
advanced technology packaging solution for high perform-  
ance and/or portable applications. The use of the latest  
materials and advanced assembly infrastructure produce a  
reliable and cost effective package. Lead free and halogen  
free compatible material sets are available. STATS ChipPAC’s  
FBGA is available in a broad range of JEDEC standard body  
sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA  
(<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and  
UFBGA (0.55mm max.) thickness. LFBGA-H (with attached  
heatsink) is qualified for small body sizes.  
Flexible body sizes range from 4mm x 4mm to  
23mm x 23mm  
• 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch  
Eutectic & Pb free solder balls  
Green package available  
• Multiple routing layers and dedicated ground/power  
planes available for improved electrical performance  
BT laminate materials (2 and 4 metal layers)  
• JEDEC standard compliant  
APPLICATIONS  
• Microprocessors/Controllers  
Wireless RF  
Analog  
ASIC  
• Memory  
• Simple PLDs  
Others  
www.statschippac.com