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FAN5909UCX

更新时间： 2024-02-23 23:38:42
品牌 Logo 应用领域
安森美 - ONSEMI 开关
页数 文件大小 规格书
15页 665K
描述
Multi-Mode Buck Converter

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中文翻译

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FAN5909UCX 技术参数

是否无铅： 不含铅生命周期：Lifetime Buy
包装说明：FBGA, BGA16,4X4,16Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
Factory Lead Time：1 week风险等级：5.67
模拟集成电路 - 其他类型：SWITCHING REGULATOR控制模式：CURRENT-MODE
JESD-30 代码：S-PBGA-B16JESD-609代码：e1
湿度敏感等级：1端子数量：16
最高工作温度：85 °C最低工作温度：-40 °C
最大输出电流：3 A封装主体材料：PLASTIC/EPOXY
封装代码：FBGA封装等效代码：BGA16,4X4,16
封装形状：SQUARE封装形式：GRID ARRAY, FINE PITCH
峰值回流温度（摄氏度）：260认证状态：Not Qualified
子类别：Switching Regulator or Controllers表面贴装：YES
最大切换频率：3200 kHz温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：0.4 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

FAN5909UCX 数据手册

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FAN5909  
Multi-Mode Buck Converter  
with LDO Assist for GSM /  
EDGE, 3 G/3.5 G and 4 G PAs  
Description  
The FAN5909 is a high−efficiency, low−noise, synchronous,  
step−down, DC−DC converter optimized for powering Radio  
Frequency (RF) Power Amplifiers (PAs) in handsets and other mobile  
applications. Load currents up to 2.5 A are allowed, which enables  
GSM / EDGE, 3 G/3.5 G, and 4G platforms under very poor VSWR  
conditions.  
www.onsemi.com  
1
The output voltage may be dynamically adjusted from 0.40 V to  
WLCSP  
16 BUMP  
CASE 567SD  
3.60 V, proportional to an analog input voltage V  
ranging from  
CON  
0.16 V to 1.44 V, optimizing power−added efficiency. Fast transition  
times of less than 6 ms are achieved, allowing excellent inter−slot  
settling.  
An integrated LDO is automatically enabled under heavy load  
conditions or when the battery voltage and voltage drop across the  
DC−DC PMOS device are within a set range of the desired output  
voltage. This LDO−assist feature supports heavy load currents under  
the most stringent battery and V  
conditions while maintaining  
SWR  
high efficiency, low dropout, and superior spectral performance.  
The FAN5909 DC−DC operates in PWM Mode with a  
2.9 MHz switching frequency and supports a single, small  
form−factor inductor ranging from 1.0 mH to 2.2 mH. In  
addition, PFM operation is allowed at low load currents for  
output voltages below 1.5 V to maximize efficiency. PFM  
operation can be disabled by setting MODE pin to LOW.  
When output regulation is not required, the FAN5909 may  
• Input Under−Voltage Lockout / Thermal Shutdown  
• 1.615 mm x 1.615 mm, 16−Bump, 0.4 mm Pitch  
WLCSP  
• 2.9 MHz PWM Mode  
• 6 ms Output Voltage Step Response for early Tx  
Power−Loop Settling with 14 mF Load Capacitance  
• Sleep Mode for ~50 mA Standby Current Consumption  
be placed in Sleep Mode by setting V  
below 100 mV  
CON  
nominally. This ensures a very low I (<50 mA) while  
• Forced PWM Mode  
Q
enabling a fast return to output regulation.  
♦ Up to 95% Efficient Synchronous Operation in High  
Power Conditions  
FAN5909 is available in a low profile, small form factor,  
16 bump, Wafer−Level Chip−Scale Package (WLCSP) that  
is 1.615 mm x 1.615 mm. Only three external components  
are required: two 0402 capacitors and one 2016 inductor.  
♦ 2.9 MHz PWM−Only Mode  
• Auto PFM/PWM Mode  
♦ 2.9 MHz PWM Operation at High Power and PFM  
Operation at Low Power and Low Output Voltage  
for Maximum Low Current Efficiency  
Features  
2
• Solution Size < 9.52 mm  
• 2.7 V to 5.5 V Input Voltage Range  
Applications  
• Dynamic Supply Bias for Polar or Linear GSM / EDGE  
PAs and 3 G/3.5 G and 4 G PAs  
• V  
Range from 0.40 V to 3.60 V (or V )  
IN  
OUT  
• Single, Small Form−Factor Inductor  
• 29 mW Integrated LDO  
• 100% Duty Cycle for Low−Dropout Operation  
• Dynamic Supply Bias for GSM / EDGE Quad Band  
Amplifiers for Mobile Handsets and Data Cards  
ORDERING INFORMATION  
†
Part Number  
Output Voltage  
Temperature Range  
Package  
Packing  
FAN5909UCX  
0.4 V to PVIN  
−40°C to +85°C  
1.615 mm x 1.615 mm, 16−Bump 0.4 mm Pitch,  
Wafer−Level Chip−Scale Package (WLCSP)  
Tape and Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
November, 2017 − Rev. 2  
FAN5909/D  
1234567...15

中文翻译

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