是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | WLCSP-25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 18 weeks | 风险等级: | 0.93 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PBGA-B25 | JESD-609代码: | e1 |
长度: | 2.4 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 25 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA25,5X5,16 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
座面最大高度: | 0.625 mm | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 4 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
宽度: | 2 mm | Base Number Matches: | 1 |
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