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FDMF6704 PDF预览

FDMF6704

更新时间: 2024-02-17 14:58:40
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器MOSFET驱动器驱动程序和接口接口集成电路服务器主板节能技术
页数 文件大小 规格书
13页 678K
描述
The Xtra Small High Performance, High Frequency DrMOS Module

FDMF6704 技术参数

是否无铅:不含铅生命周期:Active
包装说明:HVQCCN,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:5.66
Is Samacsys:N高边驱动器:YES
接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVERJESD-30 代码:S-XQCC-N40
JESD-609代码:e4长度:6 mm
湿度敏感等级:1功能数量:1
端子数量:40标称输出峰值电流:0.2 A
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:0.8 mm最大供电电压:14 V
最小供电电压:8 V标称供电电压:12 V
表面贴装:YES端子面层:Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmBase Number Matches:1

FDMF6704 数据手册

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September 2008  
TM  
FDMF6704 - XS DrMOS  
tm  
The Xtra Small High Performance, High Frequency DrMOS Module  
Benefits  
General Description  
TM  
¢
Ultra compact size - 6 mm x 6 mm MLP, 44 % space  
The XS  
DrMOS family is Fairchild’s next-generation fully-  
saving compared to conventional MLP 8 mm x 8 mm  
DrMOS packages.  
optimized ultra-compact integrated MOSFET plus driver power  
stage solution for high current, high frequency synchronous  
buck DC-DC applications. The FDMF6704 DrMOS integrates a  
driver IC, two power MOSFETs and a bootstrap Schottky diode  
into a thermally enhanced compact 6 mm x 6 mm MLP  
package. With an integrated approach, the complete switching  
power stage is optimized with regards to driver and MOSFET  
¢
¢
¢
¢
Fully optimized system efficiency.  
Clean voltage waveforms with reduced ringing.  
High frequency operation.  
Compatible with a wide variety of PWM controllers in the  
market.  
dynamic performance, system inductance and R  
. This  
DS(ON)  
greatly reduces the package parasitics and layout challenges  
associated with conventional discrete solutions. The driver IC  
incorporates advanced features such as SMOD. PWM input is  
Tri-State compatible. A 5 V gate drive and an improved PCB  
interface [Low Side MOSFET exposed pad] ensure higher  
performance. This product is compatible with the new Intel  
6 mm x 6 mm DrMOS specification.  
Features  
¢
Ultra- compact thermally enhanced 6 mm x 6 mm MLP  
package 84 % smaller than conventional discrete solutions.  
¢
¢
¢
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Synchronous driver plus FET multichip module.  
High current handling of 35 A.  
Over 93 % peak efficiency.  
Tri-State PWM input.  
Fairchild's PowerTrench® 5 technology MOSFETs for clean  
Applications  
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Compact blade servers V-core, non V-core and VTT DC-DC  
converters.  
voltage waveforms and reduced ringing.  
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Optimized for high switching frequencies of up to 1 MHz.  
Skip mode SMOD [low side gate turn off] input.  
Desktop computers V-core, non V-core and VTT DC-DC  
converters.  
TM  
Fairchild SyncFET [integrated Schottky diode] technology  
Workstations V-core, non V-core and VTT DC-DC  
converters.  
in the low side MOSFET.  
¢
¢
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Integrated bootstrap Schottky diode.  
Adaptive gate drive timing for shoot-through protection.  
Driver output disable function [DISB# pin].  
Undervoltage lockout (UVLO).  
Gaming Motherboards V-core, non V-core and VTT DC-DC  
converters.  
¢
¢
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Gaming consoles.  
High-current DC-DC Point of Load (POL) converters.  
Networking and telecom microprocessor voltage regulators.  
Fairchild Green Packaging and RoHS  
compliant. Low profile SMD package.  
Power Train Application Circuit  
5 V  
C
VCIN  
C
12 V  
VDRV  
C
VIN  
VDRV  
DISB#  
PWM  
V
V
IN  
CIN  
DISB#  
BOOT  
C
BOOT  
PWM Input  
OFF  
PHASE  
VSWH  
SMOD#  
OUTPUT  
ON  
C
CGND PGND  
OUT  
Figure 1. Power Train Application Circuit  
Ordering Information  
Current Rating @ 350 kHz Input Voltage Typical  
Frequency Max  
[kHz]  
Device  
Marking  
Part  
[A]  
[V]  
FDMF6704  
35  
8-14  
1000  
FDMF6704  
©2008 Fairchild Semiconductor Corporation  
FDMF6704 Rev.D  
1
www.fairchildsemi.com  

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