F28M35H52C, F28M35H52C-Q1, F28M35H22C
F28M35H52C, F28M35H52C-Q1, F28M35H22C
F28M35M52C, F28M35M22C, F28M35E20B
F28M35M52C, F28M35M22C, F28M35E20B
www.ti.com
SPRS742L – JUNE 2011 – REVISED FEBRUARY 2021
SPRS742L – JUNE 2011 – REVISED FEBRUARY 2021
F28M35x Concerto™ Microcontrollers
– Embedded memory
1 Features
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Up to 512KB of flash (ECC)
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Master Subsystem — Arm® Cortex®-M3
Up to 36KB of RAM (ECC or parity)
Up to 64KB of shared RAM
2KB of IPC Message RAM
– Up to 100 MHz
– Embedded memory
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Up to 512KB of flash (ECC)
– IEEE-754 single-precision Floating-Point Unit
Up to 32KB of RAM (ECC or parity)
Up to 64KB of shared RAM
2KB of IPC Message RAM
(FPU)
– Viterbi, Complex Math, CRC Unit (VCU)
– Serial Communications Interface (SCI)
– Five Universal Asynchronous Receiver/
Transmitters (UARTs)
– SPI
– I2C
– Four Synchronous Serial Interfaces (SSIs) and
a Serial Peripheral Interface (SPI)
– Two Inter-integrated Circuits (I2Cs)
– Universal Serial Bus On-the-Go (USB-OTG) +
PHY
– 10/100 ENET 1588 MII
– Two Controller Area Network, D_CAN, modules
(pin-bootable)
– 32-channel Micro Direct Memory Access
(µDMA)
– Dual security zones (128-bit password per
zone)
– External Peripheral Interface (EPI)
– Micro Cyclic Redundancy Check (µCRC)
module
– Four general-purpose timers
– Two watchdog timer modules
– Three external interrupts
– Endianness: little endian
Clocking
– On-chip crystal oscillator and external clock
input
– Dynamic Phase-Locked Loop (PLL) ratio
changes supported
1.2-V digital, 1.8-V analog, 3.3-V I/O design
Interprocessor Communications (IPC)
– 32 handshaking channels
– Four channels generate IPC interrupts
– Can be used to coordinate transfer of data
through IPC Message RAMs
– 6-channel Direct Memory Access (DMA)
– Nine Enhanced Pulse Width Modulator (ePWM)
modules
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18 outputs (16 high-resolution)
– Six 32-bit Enhanced Capture (eCAP) modules
– Three 32-bit Enhanced Quadrature Encoder
Pulse (eQEP) modules
– Multichannel Buffered Serial Port (McBSP)
– EPI
– One security zone (128-bit password)
– Three 32-bit timers
– Endianness: little endian
Analog Subsystem
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– Dual 12-bit Analog-to-Digital Converters
(ADCs)
– Up to 2.88 MSPS
– Up to 20 channels
– Four Sample-and-Hold (S/H) circuits
– Up to six comparators with 10-bit Digital-to-
Analog Converter (DAC)
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Package
– 144-Pin RFP PowerPAD™ Thermally Enhanced
Thin Quad Flatpack (HTQFP)
Temperature options:
– T: –40°C to 105°C Junction
– S: –40°C to 125°C Junction
– Q: –40°C to 125°C Free-Air
(AEC Q100 qualification for automotive
applications)
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2 Applications
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Up to 74 individually programmable, multiplexed
General-Purpose Input/Output (GPIO) pins
– Glitch-free I/Os
Control Subsystem — TMS320C28x 32-bit CPU
– Up to 150 MHz
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Automated sorting equipment
CNC control
Central inverter
String inverter
AC drive control module
– C28x core hardware built-in self-test
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
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F28M35E20B