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ESDULC8V0LB PDF预览

ESDULC8V0LB

更新时间: 2024-11-19 14:54:27
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 386K
描述
Tape&Reel: 10Kpcs/Reel;

ESDULC8V0LB 数据手册

 浏览型号ESDULC8V0LB的Datasheet PDF文件第2页浏览型号ESDULC8V0LB的Datasheet PDF文件第3页浏览型号ESDULC8V0LB的Datasheet PDF文件第4页 
ESDULC8V0LB  
Features  
Ultra Low Leakage  
Ultra Low Capacitance  
ESD  
Low Clamping Voltage  
Moisture Sensitivity Level 1  
Protection  
Device  
Epoxy Meets UL 94 V-0 Flammability Rating  
Halogen Free. “Green” Device (Note 1)  
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
DFN1006-2  
±25KV  
±20KV  
Air  
IEC61000-4-2(ESD)  
Contact  
A
P
PK  
Peak Pulse Power (8/20μs)  
90W  
C
B
(Note 2)  
I
D
PP  
3.5A  
Peak Pulse Current (8/20μs)  
T
J
Operating Junction Temperature Range  
Storage Temperature Range  
Note:  
-55°C to +125°C  
-55°C to +150°C  
-
T
STG  
F
H
1. Halogen free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine  
(<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
2.Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC61000-4-5.  
H
-
G
LL  
DIMENSIONS  
INCHES  
MM  
DIM  
NOTE  
MIN MAX MIN MAX  
0.018 0.022 0.45 0.55  
0.000 0.002 0.00 0.05  
0.005 0.007 0.12 0.18  
0.037 0.041 0.95 1.05  
0.022 0.026 0.55 0.65  
A
B
C
D
E
F
Internal Structure  
Marking Code  
0.026  
0.650  
TYP.  
G
H
L
0.018 0.022 0.45 0.55  
0.003 0.007 0.07 0.17  
0.008 0.012 0.20 0.30  
SUGGESTED SOLDER PAD LAYOUT  
(mm)  
81  
0.5  
1.3  
0.8  
0.3  
0.6  
Rev.4-1-06092023  
1/4  
MCCSEMI.COM  

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