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ESDSBSLC3V3LB PDF预览

ESDSBSLC3V3LB

更新时间: 2024-11-19 14:54:15
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 402K
描述
Tape&Reel: 10Kpcs/Reel;

ESDSBSLC3V3LB 数据手册

 浏览型号ESDSBSLC3V3LB的Datasheet PDF文件第2页浏览型号ESDSBSLC3V3LB的Datasheet PDF文件第3页浏览型号ESDSBSLC3V3LB的Datasheet PDF文件第4页 
ESDSBSLC3V3LB  
Features  
Solid-state Silicon technology  
Ultra Low Capacitance  
Snap Back  
Ultra Low Clamping Voltage  
Moisture Sensitivity Level 1  
ESD Protection  
Device  
Epoxy Meets UL 94 V-0 Flammability Rating  
Halogen Free. “Green” Device (Note 1)  
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
Operating Junction Temperature Range: -55°C to +125°C  
Storage Temperature Range: -55°C to +150°C  
DFN1006-2  
MCC  
Device Marking  
Part Number  
A
C
ESDSBSLC3V3LB  
3U  
B
D
±30KV  
±30KV  
Air  
Contact  
IEC61000-4-2(ESD)  
-
F
Peak Pulse Current(8/20μs)  
Peak Pulse Power (8/20μs)  
IPP  
4A  
H
H
-
G
PPK  
34W  
LL  
Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
DIMENSIONS  
INCHES  
MM  
DIM  
NOTE  
MIN MAX MIN MAX  
0.018 0.022 0.45 0.55  
0.000 0.002 0.00 0.05  
0.005 0.007 0.12 0.18  
0.037 0.041 0.95 1.05  
0.022 0.026 0.55 0.65  
A
B
C
D
E
F
Internal Structure  
0.026  
0.650  
TYP.  
G
H
L
0.018 0.022 0.45 0.55  
0.003 0.007 0.07 0.17  
0.008 0.012 0.20 0.30  
SUGGESTED SOLDER PAD LAYOUT  
(mm)  
Pin2  
Pin1  
0.5  
1.3  
0.8  
0.3  
0.6  
Rev.3-4-01062021  
1/4  
MCCSEMI.COM  

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