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ESDL3552BPFCT5G PDF预览

ESDL3552BPFCT5G

更新时间: 2024-09-27 11:14:19
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
6页 290K
描述
超低电容 ESD 保护二极管

ESDL3552BPFCT5G 数据手册

 浏览型号ESDL3552BPFCT5G的Datasheet PDF文件第2页浏览型号ESDL3552BPFCT5G的Datasheet PDF文件第3页浏览型号ESDL3552BPFCT5G的Datasheet PDF文件第4页浏览型号ESDL3552BPFCT5G的Datasheet PDF文件第5页浏览型号ESDL3552BPFCT5G的Datasheet PDF文件第6页 
DATA SHEET  
www.onsemi.com  
Ultra-Low Capacitance ESD  
Protection Diodes  
MicroPackaged Diodes for ESD Protection  
X4DFN3  
CASE 718AB  
ESDL3552B  
The ESDL3552B is designed to protect voltage sensitive  
components that require ultra-low capacitance from ESD and transient  
voltage events. Excellent clamping capability, low capacitance, high  
breakdown voltage, high linearity, low leakage, and fast response time  
make these parts ideal for ESD protection on designs where board  
space is at a premium. It has industry leading capacitance linearity  
over voltage making it ideal for highspeed data line protection  
applications.  
MARKING DIAGRAM  
PIN 1  
A
= Specific Device Code  
Features  
I/O  
I/O  
Pin 1  
Pin 3  
Industry Leading Capacitance Linearity Over Voltage  
UltraLow Capacitance: 0.25 pF  
Insertion Loss: 0.26 dB @ 5 GHz  
0201 Isolated DSN Package: 0.62 mm x 0.32 mm  
Standoff Voltage: 5.0 V  
Low Leakage: < 50 nA  
Low Dynamic Resistance: < 1.0 W  
These Devices are PbFree, HalogenFree/BFRFree and are RoHS  
Compliant  
GND  
Pin 2  
Typical Applications  
High Speed Data Line Protection  
USB 2.0, USB 3.0, USB 3.1  
ORDERING INFORMATION  
Package  
Device  
Shipping  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
X4DFN3  
(PbFree/  
Halide  
10000 / Tape  
& Reel  
Rating  
Symbol  
Value  
Unit  
ESDL3552BPFCT5G  
IEC 6100042 Level 4 (Contact) (Note 1)  
IEC 6100042 Level 4 (Air) (Note 1)  
ESD  
20  
20  
kV  
Free)  
Maximum Peak Pulse Current  
I
2.0  
A
PP  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
IEC 6100045 8/20 ms (Lightning) (Note 2)  
Total Power Dissipation (Note 3) @ T = 25°C  
Thermal Resistance, JunctiontoAmbient  
°P °  
R
300  
400  
mW  
°C/W  
A
D
q
JA  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
Lead Solder Temperature Maximum  
(10 Second Duration)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Nonrepetitive current pulse at T = 25°C, per IEC6100042 waveform.  
A
2. Nonrepetitive current pulse at T = 25°C, per IEC6100045 waveform.  
A
3. Mounted with recommended minimum pad size, DC board FR4  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
April, 2022 Rev. 1  
ESDL3552B/D  
 

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