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ESDAULC6-3BP6 PDF预览

ESDAULC6-3BP6

更新时间: 2024-11-06 03:19:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
11页 305K
描述
ESD protection for high speed interface

ESDAULC6-3BP6 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-6针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:1.72
其他特性:HIGH RELIABILITY, ULTRA LOW CAPACITANCE最大击穿电压:9.2 V
最小击穿电压:6 V击穿电压标称值:7.6 V
配置:COMMON ANODE, 4 ELEMENTS二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PDSO-F6
JESD-609代码:e3湿度敏感等级:1
元件数量:4端子数量:6
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:BIDIRECTIONAL
认证状态:Not Qualified子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Matte Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:30
Base Number Matches:1

ESDAULC6-3BP6 数据手册

 浏览型号ESDAULC6-3BP6的Datasheet PDF文件第2页浏览型号ESDAULC6-3BP6的Datasheet PDF文件第3页浏览型号ESDAULC6-3BP6的Datasheet PDF文件第4页浏览型号ESDAULC6-3BP6的Datasheet PDF文件第5页浏览型号ESDAULC6-3BP6的Datasheet PDF文件第6页浏览型号ESDAULC6-3BP6的Datasheet PDF文件第7页 
ESDAULC6-3BP6  
ESDAULC6-3BF2  
ESD protection for high speed interface  
Main applications  
Where transient overvoltage protection in ESD  
sensitive equipment is required, such as:  
Computers  
Printers  
SOT-666  
ESDAULC6-3BP6  
Flip-Chip  
ESDAULC6-3BF2  
Communication systems  
Cellular phones handsets and accessories  
Video equipment  
Figure 1.  
Functional diagram  
A
B
Features  
1
2
3
6
5
4
I/O1  
NC  
GND  
NC  
I/O1  
GND  
1
2
Ultra low capacitance 1.25 pF max.  
Bi-directional protection  
RoHS package  
I/O3  
I/O2  
I/O2  
I/O3  
Top view  
ESDAULC6-3BP6  
Bump side view  
ESDAULC6-3BF2  
Description  
The ESDAULC6-3Bxx is a monolithic application  
specific discrete device dedicated to ESD  
protection of high speed interfaces such as  
USB2.0.  
Figure 2.  
Pin configuration  
I/O1  
I/O2  
I/O3  
The device is ideal for applications where both  
reduced print circuit board space and power  
absorption capability are required.  
Benefits  
GND  
Ultra low capacitance bidirectional ESD  
Table 1.  
Order codes  
protection  
Part number  
Marking  
Low PCB space consumption:  
2
2
2.5 mm max footprint (1.7 mm for Flip-Chip)  
ESDAULC6-3BP6  
ESDAULC6-3BF2  
3
Enhanced ESD protection:  
– 15 kV contact discharge  
– 15 kV air discharge  
3B  
Complies with the following standards:  
IEC 61000-4-2 level 4:  
No insertion loss to 3.0 GHz  
8 kV (contact discharge)  
15 kV (air discharge)  
Ultra low leakage current  
High reliability offered by monolithic integration  
MIL STD 883G-Method 3015-7: class 3B  
HBM (Human Body Model)  
July 2007  
Rev 1  
1/11  
www.st.com  
11  

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