ESD7331
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESD7331 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, the
part is well suited for use in high frequency designs such as USB 2.0
high speed applications.
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1
2
Cathode
Anode
Features
• Low Capacitance 0.4 pF (Typ)
• Low Clamping Voltage
MARKING
DIAGRAM
PIN 1
• Small Body Outline Dimensions: 0.60 mm x 0.30 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 3.3 V
6
X3DFN2
CASE 152AF
M
• IEC61000−4−2 Level 4 ESD Protection
6
= Specific Device Code
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Rotated 180°)
= Date Code
Compliant
M
Typical Applications
• USB 2.0/3.0
• MHL 2.0
ORDERING INFORMATION
†
Device
ESD7331MUT5G
Package
Shipping
• eSATA
X3DFN2
15000 / Tape &
Reel
(Pb−Free)
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Contact
Air
15
15
kV
Total Power Dissipation on FR−5 Board
°P °
250
mW
D
(Note 1) @ T = 25°C
A
Thermal Resistance, Junction−to−Ambient
R
400
−55 to +150
260
°C/W
°C
q
JA
Junction and Storage Temperature Range T , T
J
stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
April, 2017 − Rev. 0
ESD7331/D