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ESD7331

更新时间: 2022-02-26 12:46:09
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 126K
描述
ESD Protection Diode

ESD7331 数据手册

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ESD7331  
ESD Protection Diode  
Micro−Packaged Diodes for ESD Protection  
The ESD7331 is designed to protect voltage sensitive components  
that require low capacitance from ESD and transient voltage events.  
Excellent clamping capability, low capacitance, low leakage, and fast  
response time, make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its low capacitance, the  
part is well suited for use in high frequency designs such as USB 2.0  
high speed applications.  
www.onsemi.com  
1
2
Cathode  
Anode  
Features  
Low Capacitance 0.4 pF (Typ)  
Low Clamping Voltage  
MARKING  
DIAGRAM  
PIN 1  
Small Body Outline Dimensions: 0.60 mm x 0.30 mm  
Low Body Height: 0.3 mm  
Stand−off Voltage: 3.3 V  
6
X3DFN2  
CASE 152AF  
M
IEC61000−4−2 Level 4 ESD Protection  
6
= Specific Device Code  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
(Rotated 180°)  
= Date Code  
Compliant  
M
Typical Applications  
USB 2.0/3.0  
MHL 2.0  
ORDERING INFORMATION  
Device  
ESD7331MUT5G  
Package  
Shipping  
eSATA  
X3DFN2  
15000 / Tape &  
Reel  
(Pb−Free)  
MAXIMUM RATINGS  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Contact  
Air  
15  
15  
kV  
Total Power Dissipation on FR−5 Board  
°P °  
250  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, Junction−to−Ambient  
R
400  
−55 to +150  
260  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
April, 2017 − Rev. 0  
ESD7331/D  
 

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