Datasheet > ESD5Z12T1G/T5G

ESD5Z12T1G/T5G

更新时间： 2022-02-26 10:52:15

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
5页	70K
描述
Transient Voltage suppressors

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ESD5Z12T1G/T5G 数据手册

ESD5Z2.5T1G Series,

SZESD5Z2.5T1G Series

Transient Voltage

Suppressors

Micro−Packaged Diodes for ESD Protection

http://onsemi.com

The ESD5Z Series is designed to protect voltage sensitive

components from ESD and transient voltage events. Excellent

clamping capability, low leakage, and fast response time, make these

parts ideal for ESD protection on designs where board space is at a

premium. Because of its small size, it is suited for use in cellular

phones, portable devices, digital cameras, power supplies and many

other portable applications.

SOD−523

CASE 502

STYLE 1

Specification Features:

• Low Clamping Voltage

Cathode

Anode

• Small Body Outline Dimensions:

0.047″ x 0.032″ (1.20 mm x 0.80 mm)

• Low Body Height: 0.028″ (0.7 mm)

• Stand−off Voltage: 2.5 V − 12 V

MARKING DIAGRAM

• Peak Power up to 240 Watts @ 8 x 20 ms Pulse

• Low Leakage

• Response Time is Typically < 1 ns

XX = Specific Device Code

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

• IEC61000−4−2 Level 4 ESD Protection

• IEC61000−4−4 Level 4 EFT Protection

= Date Code

= Pb−Free Package

(Note: Microdot may be in either location)

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

*Date Code orientation may vary

depending upon manufacturing location.

• These Devices are Pb−Free and are RoHS Compliant*

ORDERING INFORMATION

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

†

Device

Package

Shipping

SZ/ESD5ZxxxT1G

SOD−523

Pb−Free

3000 /

Tape & Reel

ESD5ZxxxT5G

SOD−523

Pb−Free

8000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 3 of this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

December, 2014 − Rev. 13

ESD5Z2.5T1/D

12 3 4 5

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