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ESD5Z12T1G PDF预览

ESD5Z12T1G

更新时间： 2024-01-21 10:38:54
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
4页 111K
描述
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection

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ESD5Z12T1G 技术参数

是否无铅： 不含铅生命周期：Active
包装说明：R-PDSO-F2针数：2
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50Factory Lead Time：1 week
风险等级：1.19Samacsys Description：NULL
最小击穿电压：14.1 V最大钳位电压：17 V
配置：SINGLE二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码：R-PDSO-F2
JESD-609代码：e3湿度敏感等级：1
最大非重复峰值反向功率耗散：240 W元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260极性：UNIDIRECTIONAL
最大功率耗散：0.2 W认证状态：Not Qualified
参考标准：IEC-61000-4-2, 4-4最大重复峰值反向电压：12 V
子类别：Transient Suppressors表面贴装：YES
技术：AVALANCHE端子面层：Tin (Sn)
端子形式：FLAT端子位置：DUAL
处于峰值回流温度下的最长时间：40

ESD5Z12T1G 数据手册

 浏览型号ESD5Z12T1G的Datasheet PDF文件第2页浏览型号ESD5Z12T1G的Datasheet PDF文件第3页浏览型号ESD5Z12T1G的Datasheet PDF文件第4页 
ESD5Z2.5T1 SERIES  
Transient Voltage  
Suppressors  
Micro−Packaged Diodes for ESD Protection  
The ESD5Z Series is designed to protect voltage sensitive components  
from ESD and transient voltage events. Excellent clamping capability,  
low leakage, and fast response time, make these parts ideal for ESD  
protection on designs where board space is at a premium. Because of its  
small size, it is suited for use in cellular phones, portable devices, digital  
cameras, power supplies and many other portable applications.  
http://onsemi.com  
1
2
Cathode  
Anode  
Specification Features:  
• Small Body Outline Dimensions:  
0.047″ x 0.032″ (1.20 mm x 0.80 mm)  
• Low Body Height: 0.028″ (0.7 mm)  
• Stand−off Voltage: 2.5 V − 12 V  
• Peak Power up to 240 Watts @ 8 x 20 ms Pulse  
2
1
SOD−523  
CASE 502  
PLASTIC  
• Low Leakage  
• Response Time is Typically < 1 ns  
• ESD Rating of Class 3 (> 16 kV) per Human Body Model  
• IEC61000−4−2 Level 4 ESD Protection  
• IEC61000−4−4 Level 4 EFT Protection  
• Pb−Free Packages are Available  
MARKING DIAGRAM  
XX  
G
2
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
XX = Specific Device Code  
M
= Date Code  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary  
depending upon manufacturing location.  
MAXIMUM RATINGS  
ORDERING INFORMATION  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
†
Device  
Package  
Shipping  
Air  
Contact  
±30  
±30  
kV  
ESD5ZxxxT1  
ESD5ZxxxT1G  
SOD−523  
3000/Tape & Reel  
3000/Tape & Reel  
IEC 61000−4−4 (EFT)  
40  
A
SOD−523  
Pb−Free  
ESD Voltage  
Per Human Body Model  
Per Machine Model  
16  
400  
kV  
V
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Power Dissipation on FR−5 Board  
°P °  
D
200  
mW  
(Note 1) @ T = 25°C  
A
Junction and Storage Temperature Range  
T , T  
−55 to  
°C  
J
stg  
+150  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 2 of this data sheet.  
Lead Solder Temperature − Maximum  
T
260  
°C  
L
(10 Second Duration)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
October, 2006 − Rev. 5  
ESD5Z2.5T1/D  
 
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