Datasheet > ESD5581MXT5G

ESD5581MXT5G

更新时间： 2024-10-04 01:13:15

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
8页	140K
描述
ESD Protection Diode

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中文翻译

获取价格

数据手册

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ESD5581MXT5G 数据手册

ESD5581

ESD Protection Diode

Micro−Packaged Diodes for ESD Protection

The ESD5581 is designed to protect voltage sensitive components

that require low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs

where board space is at a premium.

www.onsemi.com

Features

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.62 mm x 0.32 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 5 V

MARKING

DIAGRAM

• IEC61000−4−2 Level 4 ESD Protection

PIN 1

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

X3DFN2

CASE 152AF

Compliant

Typical Applications

• mSD Card Protection

• Audio Line Protection

• GPIO

= Specific Device Code

= Date Code

X2DFN2

CASE 714AB

(In Development)

XX M

MAXIMUM RATINGS

Rating

IEC 61000−4−2 (ESD)

Symbol

Value

Unit

XX = Specific Device Code

Contact

Air

= Date Code

= Pb−Free Package

Total Power Dissipation on FR−5 Board

°P °

250

(Note 1) @ T = 25°C

Thermal Resistance, Junction−to−Ambient

400

−55 to +150

260

°C/W

°C

ORDERING INFORMATION

Junction and Storage Temperature Range T , T

stg

†

Device

Package

Shipping

Lead Solder Temperature − Maximum

(10 Second Duration)

°C

ESD5581MXT5G

X3DFN2

(Pb−Free)

10000 / Tape &

Reel

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

ESD5581N2T5G

(In Development)

X2DFN2

(Pb−Free)

10000 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

See Application Note AND8308/D for further description of survivability specs.

This document contains information on some products that are still under development.

ON Semiconductor reserves the right to change or discontinue these products without

notice.

Publication Order Number:

January, 2017 − Rev. 4

ESD5581/D

12 3 4 5 6 7 8

中文翻译

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