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ESD5381_16 PDF预览

ESD5381_16

更新时间: 2022-02-26 12:14:57
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 93K
描述
ESD Protection Diodes

ESD5381_16 数据手册

 浏览型号ESD5381_16的Datasheet PDF文件第2页浏览型号ESD5381_16的Datasheet PDF文件第3页浏览型号ESD5381_16的Datasheet PDF文件第4页浏览型号ESD5381_16的Datasheet PDF文件第5页 
ESD5381 Series  
ESD Protection Diodes  
Micro−Packaged Diodes for ESD Protection  
The ESD5381 series are designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage,  
and fast response time provide best in class protection on designs that  
are exposed to ESD. Because of their small size, they are suited for use  
in cellular phones, MP3 players, digital cameras and many other  
portable applications where board space comes at a premium.  
www.onsemi.com  
1
2
Cathode  
Anode  
Specification Features  
Low Capacitance  
Low Clamping Voltage  
MARKING  
DIAGRAM  
Small Body Outline Dimensions: 0.60 mm x 0.30 mm  
Low Body Height: 0.3 mm  
Low Leakage  
PIN 1  
X M  
X3DFN2  
CASE 152AF  
Response Time is < 1 ns  
IEC61000−4−2 Level 4 ESD Protection  
IEC61000−4−4 Level 4 EFT Protection  
X
M
= Specific Device Code  
= Date Code  
(Specific marking on following page)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
Mechanical Characteristics  
ORDERING INFORMATION  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
Device  
Package  
Shipping  
ESD5381MUT5G  
X3DFN2  
(Pb−Free)  
10000 /  
Tape & Reel  
MAXIMUM RATINGS  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
ESD5382MUT5G  
X3DFN2  
(Pb−Free)  
10000 /  
Tape & Reel  
Contact  
Air  
8
kV  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Power Dissipation on FR−5 Board  
°P °  
D
300  
mW  
(Note 1) @ T = 25°C  
A
Thermal Resistance, Junction−to−Ambient  
R
400  
−55 to +150  
260  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2016 − Rev. 6  
ESD5381/D  
 

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