Datasheet > ESD5371

ESD5371

更新时间： 2024-02-23 20:08:30

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
7页	133K
描述
ESD Protection Diode

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ESD5371 数据手册

ESD5371

ESD Protection Diode

Micro−Packaged Diodes for ESD Protection

The ESD5371 is designed to protect voltage sensitive components

that require low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs

where board space is at a premium.

www.onsemi.com

Features

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.62 mm x 0.32 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 3.3 V

MARKING

DIAGRAM

• IEC61000−4−2 Level 4 ESD Protection

PIN 1

X3DFN2

CASE 152AF

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• mSD Card Protection

• Audio Line

= Specific Device Code

= Date Code

• GPIO

ORDERING INFORMATION

MAXIMUM RATINGS

†

Device

ESD5371MXT5G

Package

Shipping

Rating

IEC 61000−4−2 (ESD)

Symbol

Value

Unit

X3DFN2

(Pb−Free)

10000 / Tape &

Reel

Contact

Air

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Total Power Dissipation on FR−5 Board

°P °

250

(Note 1) @ T = 25°C

Thermal Resistance, Junction−to−Ambient

400

−55 to +150

260

°C/W

°C

Junction and Storage Temperature Range T , T

stg

Lead Solder Temperature − Maximum

(10 Second Duration)

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Publication Order Number:

January, 2017 − Rev. 3

ESD5371/D

12 3 4 5 6 7

中文翻译

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