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ESD4-LFC_07 PDF预览

ESD4-LFC_07

更新时间: 2024-11-01 03:34:51
品牌 Logo 应用领域
PROTEC /
页数 文件大小 规格书
4页 64K
描述
LOW CAPACITANCE FLIP CHIP ARRAY

ESD4-LFC_07 数据手册

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ESD4-LFC  
LOW CAPACITANCE FLIP CHIP ARRAY  
APPLICATIONS  
Cellular Phones  
I/O Ports  
Notebooks & Pocket PCs  
Personal Digital Assistant (PDA)  
Ground Positioning System (GPS)  
SMART Cards  
IEC COMPATIBILITY (EN61000-4)  
5 BUMP FLIP CHIP  
61000-4-2 (ESD): Air - 15kV, Contact - 8kV  
61000-4-4 (EFT): 40A - 5/50ns  
FEATURES  
ESD Protection > 25 kilovolts  
Unidirectional Configuration  
Low Capacitance: 15pF  
Protects Up to Four(4) Data Lines  
RoHS Compliant  
MECHANICAL CHARACTERISTICS  
5 Bump Flip Chip Package  
Weight 0.73 milligrams (Approximate)  
Available in Lead-Free Plating  
Solder Reflow Temperature:  
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C  
Consult Factory for Leaded DeviceAvailability  
Flammability Rating UL 94V-0  
8mm Tape and Reel Per EIAStandard 481  
PIN CONFIGURATION  
G1  
05210.R3 2/07  
1
www.protekdevices.com  

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