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ESD4-LFC-T73-1 PDF预览

ESD4-LFC-T73-1

更新时间: 2024-11-01 14:50:07
品牌 Logo 应用领域
PROTEC 局域网二极管
页数 文件大小 规格书
6页 467K
描述
Trans Voltage Suppressor Diode, 200W, 5V V(RWM), Unidirectional, 4 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-5

ESD4-LFC-T73-1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:FLIP-CHIP
包装说明:R-PBGA-B5针数:5
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.51
其他特性:LOW CAPACITANCE最小击穿电压:6 V
配置:COMMON ANODE, 4 ELEMENTS二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PBGA-B5
JESD-609代码:e3最大非重复峰值反向功率耗散:200 W
元件数量:4端子数量:5
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:GRID ARRAY峰值回流温度(摄氏度):NOT SPECIFIED
极性:UNIDIRECTIONAL最大功率耗散:0.2 W
认证状态:Not Qualified最大重复峰值反向电压:5 V
表面贴装:YES技术:AVALANCHE
端子面层:Tin (Sn)端子形式:BALL
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

ESD4-LFC-T73-1 数据手册

 浏览型号ESD4-LFC-T73-1的Datasheet PDF文件第2页浏览型号ESD4-LFC-T73-1的Datasheet PDF文件第3页浏览型号ESD4-LFC-T73-1的Datasheet PDF文件第4页浏览型号ESD4-LFC-T73-1的Datasheet PDF文件第5页浏览型号ESD4-LFC-T73-1的Datasheet PDF文件第6页 
ESD4-LFC  
Only One Name Means ProTek’Tion™  
LOW CAPACITANCE FLIP ChIP TꢀS ARRAy  
DESCRIPTION  
The ESD4-LFC is a low capacitance flip chip transient voltage suppressor array, designed to protect portable devices  
from the effects of Electrostaꢀc Discharge (ESD) and Electrical Fast Transients (EFT). This series meets the IEC 61000-  
4-2 and 61000-4-4 requirements. This device is ideally suited for portable devices, PCMCIA and SMART phones.  
The ESD4-LFC features superior clamping performance, low leakage current characterisꢀcs and a response ꢀme of less  
than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.  
5 BuMP PACꢁAꢂE  
FEATuRES  
APPLICATIONS  
• SMART Phones  
• I/O Port Interfaces  
• Portable Devices  
• Ground Posiꢀoning Systems (GPS)  
• SMART Cards  
• Compaꢀble with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV  
• Compaꢀble with IEC 61000-4-4 (EFT): 40A, 5/50ns  
• ESD Protecꢀon > 25 kilovolts  
• Unidirecꢀonal Configuraꢀon  
• Low Capacitance: 15pF  
• Protecꢀon for 4 Data Lines  
• RoHS Compliant  
• REACH Compliant  
MEChANICAL ChARACTERISTICS  
• 5 Bump Flip Chip Package  
• Approximate Weight: 0.73 milligrams  
• Lead-Free Plaꢀng  
• Solder Reflow Temperature:  
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C  
• Flammability Raꢀng UL 94V-0  
• 8mm Tape per EIA Standard 481  
CIRCuIT DIAꢂRAM  
G1  
www.protekdevices.com  
05210.R4 1/11  
Page 1  

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