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ESD1014 PDF预览

ESD1014

更新时间: 2024-09-21 10:15:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
3页 88K
描述
Low Capacitance ESD Protection Array for High Speed Data Lines Protection

ESD1014 数据手册

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ESD1014  
Low Capacitance ESD  
Protection Array for High  
Speed Data Lines  
Protection  
http://onsemi.com  
The ESD1014 transient voltage suppressor is designed to protect  
high speed data lines from ESD, EFT, and lightning.  
LOW CAPACITANCE  
DIODE TVS ARRAY  
Features  
Low Capacitance (6 pF Maximum Between I/O Lines and GND)  
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model  
and Class C (Exceeding 400 V) per Machine Model  
Protection for the Following IEC Standards:  
IEC 6100042 (ESD) Level 4 30 kV (Contact)  
This is a PbFree Device  
PIN CONFIGURATION  
AND SCHEMATIC  
Typical Applications  
1
2
3
4
5
10  
9
High Speed Communication Line Protection  
USB 1.1 and 2.0 Power and Data Line Protection  
Digital Video Interface (DVI)  
Monitors and Flat Panel Displays  
T1/E1 and T3/E3  
8
7
6
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAM  
Rating  
Peak Power Dissipation  
Maximum Peak Pulse Current  
Symbol  
Value  
450  
25  
Unit  
W
P
pk  
1014  
AYW  
G
UDFN10  
CASE 517AN  
I
PP  
A
8 x 20 mS @ T = 25°C  
A
1014  
A
Y
W
G
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= PbFree Package  
Operating Junction Temperature Range  
Storage Temperature Range  
T
40 to +125  
55 to +150  
260  
°C  
°C  
°C  
J
T
stg  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
Human Body Model (HBM)  
Machine Model (MM)  
IEC 6100042 Contact (ESD)  
ESD  
16000  
400  
30000  
V
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Device  
ESD1014MUTAG  
Package  
Shipping  
UDFN10 3000/Tape & Reel  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
March, 2011 Rev. 0  
ESD1014/D  

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