SPICE MODELS: ES3A ES3B ES3C
ES3D ES3AB ES3BB ES3CB ES3DB
ES3A/AB - ES3D/DB
3.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
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·
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·
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Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 100A Peak
SMB
Min
SMC
Min
B
Dim
Ideally Suited for Automated Assembly
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
Available in Lead Free Finish/RoHS Compliant Version
(Note 4)
A
B
C
D
E
G
H
J
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
A
J
C
D
Mechanical Data
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Case: SMB/SMC
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
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Moisture Sensitivity: Level 1 per J-STD-020C
G
H
Terminals: Solder Plated Terminal - Solderable per
MIL-STD-202, Method 208
E
All Dimensions in mm
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Also Available in Lead Free Plating (Matte Tin Finish).
Please see Ordering Information, Note 6, on Page 3
A, B, C, D, Suffix Designates SMC Package
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Polarity: Cathode Band or Cathode Notch
Mounting Position: Any
AB, BB, CB, DB Suffix Designates SMB Package
Ordering Information: See Page 3
Marking: Type Number, See Page 3
SMB Weight: 0.093 grams (approximate)
SMC Weight: 0.21 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
ES3A/AB
ES3B/BB
100
ES3C/CB
150
ES3D/DB
200
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
50
35
V
VR(RMS)
IO
RMS Reverse Voltage
70
105
140
V
A
Average Rectified Output Current
@ TT = 100°C
3.0
100
0.9
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
IFSM
A
Forward Voltage
@ IF = 3.0A
VFM
IRM
V
10
500
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA 25°C
=
mA
@ TA = 125°C
trr
CT
Reverse Recovery Time (Note 3)
Typical Total Capacitance (Note 2)
25
45
15
ns
pF
RqJT
Tj, TSTG
Typical Thermal Resistance, Junction to Terminal (Note 1)
Operating and Storage Temperature Range
°C/W
°C
-65 to +150
2
Notes:
1. Unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pads as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Measured with I = 0.5A, I = 1.0A, I = 0.25A. See Figure 5.
F
R
rr
4
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS14003 Rev. 9 - 2
1 of 3
ES3A/AB - ES3D/DB
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