ES1A-ES1J
1.0 AMPS. Surface Mount Super Fast Rectifiers
SMA/DO-214AC
Features
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Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain relief,
Ideal for automated placement
Easy pick and place
Super fast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:
260OC/10 seconds at terminals
Plastic material used carries Underwriters
Laboratory Classification 94V-0
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Mechanical Data
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Cases: Molded plastic
Terminals: Pure tin plated, lead free.
Polarity: Indicated by cathode band
Packing: 12mm tape
Dimensions in inches and (millimeters)
Weight: 0.064 gram
Maximum Ratings and Electrical Characteristics
Rating at 25O
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol ES ES ES ES ES ES ES ES
Type Number
Units
1A 1B 1C 1D 1F 1G 1H 1J
50 100 150 200 300 400 500 600
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
V
V
V
VRRM
VRMS
VDC
35 70 105 140 210 280 350 420
50 100 150 200 300 400 500 600
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
See Fig. 1
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
1.0
30
A
A
V
I(AV)
IFSM
Maximum Instantaneous Forward Voltage
@ 1.0A
0.95
10
1.3
1.7
VF
IR
Maximum DC Reverse Current @ TA =25 oC
5.0
100
35
uA
uA
nS
pF
oC /W
oC
oC
at Rated DC Blocking Voltage @ TA=100 oC
Maximum Reverse Recovery Time ( Note 1 )
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
Trr
Cj
8
R
85
35
θJA
R
θJL
-55 to +150
-55 to +150
Operating Temperature Range
Storage Temperature Range
TJ
TSTG
Notes:
1. Reverse Recovery Test Conditions: I
2. Measured at 1 MHz and Applied V =4.0 Volts
3. P.C.B. Mounted on 0.2 x 0.2” (5.0 x 5.0mm) Copper Pad Area.
F=0.5A, IR=1.0A, IRR=0.25A
R
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