SPICE MODELS: ES1A ES1B ES1C ES1D ES1G
ES1A - ES1G
1.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
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·
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Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 5)
SMA
B
Mechanical Data
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Dim
A
Min
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.30
Case: SMA
·
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
A
J
B
C
D
C
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Moisture Sensitivity: Level 1 per J-STD-020C
D
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
E
G
H
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Polarity: Cathode Band or Cathode Notch
Marking: Type Number & Date Code: See Below
Ordering Information: See Below
G
J
H
E
Weight: 0.064 grams (approximate)
All Dimensions in mm
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol
ES1A
50
ES1B
100
70
ES1C
ES1D
200
ES1G
400
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
150
V
VR(RMS)
IO
RMS Reverse Voltage
35
105
1.0
140
280
V
A
Average Rectified Output Current
@ TT = 110°C
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
IFSM
30
A
Forward Voltage Drop
@ IF = 0.6A
@ IF = 1.0A
0.90
0.98
¾
1.25
VFM
IRM
V
5.0
200
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA
= 25°C
mA
@ TA = 100°C
trr
CT
Reverse Recovery Time (Note 1)
Typical Total Capacitance (Note 2)
25
10
40
35
ns
pF
RqJT
Tj, TSTG
Typical Thermal Resistance, Junction to Terminal (Note 3)
Operating and Storage Temperature Range
°C/W
°C
-65 to +150
(Note 4)
Ordering Information
Device*
Packaging
Shipping
5000/Tape & Reel
ES1x-13-F
SMA
Notes: 1. Measured with I = 0.5A, I = 1.0A, I = 0.25A. See figure 5.
rr
F
R
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2
3. Unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pad as heat sink.
4. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. *x = Device type, e.g. ES1A-13-F.
5. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Marking Information
XXXX = Product type marking code, ex. ES1A
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year ex: 2 for 2002
WW = Week code 01 to 52
YWW
XXXX
DS14001 Rev. 11 - 2
1 of 3
ES1A - ES1G
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