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ERBSE0R50U PDF预览

ERBSE0R50U

更新时间: 2024-11-13 06:57:51
品牌 Logo 应用领域
松下 - PANASONIC 电熔丝电路保护
页数 文件大小 规格书
5页 233K
描述
Micro Chip Fuse

ERBSE0R50U 技术参数

生命周期:Obsolete包装说明:LEAD FREE
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8536.10.00.40风险等级:5.8
Is Samacsys:N其他特性:RATED BREAKING CAPACITY AT 32 VDC: 50 A
熔断特性:FAST主体宽度:0.8 mm
主体高度:0.7 mm主体长度或直径:1.6 mm
电路保护类型:ELECTRIC FUSE安装特点:SURFACE MOUNT
最高工作温度:100 °C最低工作温度:-40 °C
包装方法:TAPE AND REEL物理尺寸:1.6mm x 0.8mm x 0.7mm
额定分断能力:50 A额定电流:0.5 A
额定电压(直流):32 V参考标准:CSA; UL
表面贴装:YES端子形状:WRAPAROUND
Base Number Matches:1

ERBSE0R50U 数据手册

 浏览型号ERBSE0R50U的Datasheet PDF文件第2页浏览型号ERBSE0R50U的Datasheet PDF文件第3页浏览型号ERBSE0R50U的Datasheet PDF文件第4页浏览型号ERBSE0R50U的Datasheet PDF文件第5页 
Micro Chip Fuse  
Micro Chip Fuse  
Type:  
ERBSE  
ERBSD  
Features  
Small size  
Fast-acting and withstanding in-rush current characteristics  
Approved Safety Standards  
UL248-14 : File No.E194052  
c-UL(CSA)C22.2 No.248-14 : File No.E194052  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
E
R
B
S
E
1
R
0
0
U
Product Code  
Fusing Characteristics  
Fast-acting and  
Product shape  
1608 size  
(1.6 mm҂0.8 mm)  
Packaging  
Punched carrier taping  
Rated Current (A)  
U
0R25 0.25 A 1R50 1.5 A  
0R31 0.315 A 2R00 2.0 A  
0R37 0.375 A 2R50 2.5 A  
E
Micro Chip Fuse  
withstanding in-rush  
current  
S
1005 size  
(1.0 mm҂0.5 mm)  
D
0R50 0.5 A  
3R00 3.0 A  
0R75 0.75 A 4R00 4.0 A  
1R00 1.0 A  
1R25 1.25 A  
5R00 5.0 A  
Dimensions in mm (not to scale)  
Construction  
Marking  
a
Fusing Element  
Ceramic Core  
Protective Coating  
t
Electrode  
(Outer)  
L
W
Trimming  
Dimensions (mm)  
Type  
(inches)  
L
W
a
t
ERBSE  
(0603)  
ERBSD  
(0402)  
0.15  
0.10  
0.15  
0.10  
0.20  
0.15  
0.10  
0.10  
1.60  
0.80  
0.50  
0.30  
0.70  
1.00  
0.20  
0.40  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Dec. 2007  

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