是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 100 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.58 | 其他特性: | IT CAN ALSO OPERATE AT 3.3V |
JESD-30 代码: | S-PBGA-B100 | JESD-609代码: | e1 |
专用输入次数: | I/O 线路数量: | ||
端子数量: | 100 | 组织: | 0 DEDICATED INPUTS, 0 I/O |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
可编程逻辑类型: | FLASH PLD | 认证状态: | Not Qualified |
最大供电电压: | 2.625 V | 最小供电电压: | 2.375 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
EPM2210F100I | ALTERA | MAX II Device Family |
获取价格 |
|
EPM2210F100I3ES | INTEL | Flash PLD, PBGA100, 11 X 11 MM, 1 MM PITCH, FBGA-100 |
获取价格 |
|
EPM2210F100I4N | INTEL | Flash PLD, PBGA100, 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100 |
获取价格 |
|
EPM2210F256A3 | INTEL | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256 |
获取价格 |
|
EPM2210F256A3N | ALTERA | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 |
获取价格 |
|
EPM2210F256A3N | INTEL | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 |
获取价格 |