是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | BGA, BGA256,16X16,40 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.03 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 17 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 176 | 输入次数: | 176 |
逻辑单元数量: | 1728 | 输出次数: | 176 |
端子数量: | 256 | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 176 I/O | |
输出函数: | MIXED | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA256,16X16,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5,2.5/3.3 V |
可编程逻辑类型: | LOADABLE PLD | 传播延迟: | 0.4 ns |
认证状态: | Not Qualified | 座面最大高度: | 2.1 mm |
子类别: | Field Programmable Gate Arrays | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 17 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EPF10K30EFC256-2X | ETC |
获取价格 |
Field Programmable Gate Array (FPGA) | |
EPF10K30EFC256-3 | ETC |
获取价格 |
Field Programmable Gate Array (FPGA) | |
EPF10K30EFC256-3DX | ETC |
获取价格 |
ASIC | |
EPF10K30EFC256-3N | INTEL |
获取价格 |
Loadable PLD, 0.6ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 | |
EPF10K30EFC484-1 | ALTERA |
获取价格 |
Loadable PLD, 0.4ns, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EPF10K30EFC484-1 | INTEL |
获取价格 |
Loadable PLD, 0.4ns, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EPF10K30EFC484-1DX | ETC |
获取价格 |
ASIC | |
EPF10K30EFC484-1X | INTEL |
获取价格 |
Loadable PLD, 0.4ns, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EPF10K30EFC484-2 | INTEL |
获取价格 |
Loadable PLD, 0.4ns, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EPF10K30EFC484-2DX | ETC |
获取价格 |
ASIC |