是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 256 |
Reach Compliance Code: | compliant | 风险等级: | 5.89 |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e0 |
长度: | 17 mm | 端子数量: | 256 |
最高工作温度: | 70 °C | 最低工作温度: | -20 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 1.8 mm | 最大供电电压: | 2.7 V |
最小供电电压: | 2.3 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 17 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EP7309-ER | CIRRUS |
获取价格 |
Consumer Circuit, CMOS, PBGA204 | |
EP7309-ER-C | CIRRUS |
获取价格 |
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | |
EP7309-EV-C | CIRRUS |
获取价格 |
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | |
EP7309-IB | CIRRUS |
获取价格 |
High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface | |
EP7309-IB-C | CIRRUS |
获取价格 |
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | |
EP7309-IBZ | CIRRUS |
获取价格 |
High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface | |
EP7309-IR | CIRRUS |
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High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface | |
EP7309-IR-C | CIRRUS |
获取价格 |
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | |
EP7309-IV-C | CIRRUS |
获取价格 |
HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE | |
EP7309-IVZ | CIRRUS |
获取价格 |
Multifunction Peripheral, CMOS, PQFP208, LEAD FREE, LQFP-208 |