是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | BGA, BGA324(UNSPEC) |
针数: | 324 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.61 | JESD-30 代码: | S-PBGA-B324 |
JESD-609代码: | e0 | 长度: | 19 mm |
湿度敏感等级: | 3 | 专用输入次数: | 4 |
I/O 线路数量: | 246 | 输入次数: | 246 |
逻辑单元数量: | 4160 | 输出次数: | 246 |
端子数量: | 324 | 组织: | 4 DEDICATED INPUTS, 246 I/O |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA324(UNSPEC) |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 220 | 电源: | 2.5,2.5/3.3 V |
可编程逻辑类型: | LOADABLE PLD | 认证状态: | Not Qualified |
座面最大高度: | 2.1 mm | 子类别: | Field Programmable Gate Arrays |
最大供电电压: | 2.625 V | 最小供电电压: | 2.375 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 19 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EP20K100FI324-2ES | ETC |
获取价格 |
FPGA | |
EP20K100FI324-2X | INTEL |
获取价格 |
Field Programmable Gate Array, 4160-Cell, CMOS, PBGA324 | |
EP20K100FI324-2XV | ALTERA |
获取价格 |
Loadable PLD, 3ns, CMOS, PBGA324, FINE LINE, BGA-324 | |
EP20K100FI324-3 | ALTERA |
获取价格 |
Loadable PLD, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FINE LINE, BGA-324 | |
EP20K100FI324-3ES | ETC |
获取价格 |
FPGA | |
EP20K100FI324-3X | ALTERA |
获取价格 |
Field Programmable Gate Array | |
EP20K100FI484-1 | INTEL |
获取价格 |
Loadable PLD, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EP20K100FI484-3 | INTEL |
获取价格 |
Loadable PLD, PBGA484, 23 X 23 MM, 1 MM PITCH, FINE LINE, BGA-484 | |
EP20K100FI672-3 | INTEL |
获取价格 |
Loadable PLD, PBGA672, 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
EP20K100QC208-1 | ETC |
获取价格 |
Field Programmable Gate Array (FPGA) |