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EP1K30TC144-2N PDF预览

EP1K30TC144-2N

更新时间: 2024-01-15 13:59:14
品牌 Logo 应用领域
阿尔特拉 - ALTERA /
页数 文件大小 规格书
182页 2063K
描述
Package Information Datasheet for Mature Altera Devices

EP1K30TC144-2N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFP
包装说明:TQFP-144针数:144
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.14
最大时钟频率:37.5 MHzJESD-30 代码:S-PQFP-G144
JESD-609代码:e3长度:20 mm
湿度敏感等级:3I/O 线路数量:102
输入次数:102逻辑单元数量:1728
输出次数:102端子数量:144
最高工作温度:70 °C最低工作温度:
组织:102 I/O输出函数:MIXED
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP144,.87SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:2.5,2.5/3.3 V可编程逻辑类型:LOADABLE PLD
传播延迟:0.4 ns认证状态:Not Qualified
座面最大高度:1.6 mm子类别:Field Programmable Gate Arrays
最大供电电压:2.625 V最小供电电压:2.375 V
标称供电电压:2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:20 mm
Base Number Matches:1

EP1K30TC144-2N 数据手册

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Package Information Datasheet for  
Mature Altera Devices  
DS-PKG-16.8  
This datasheet provides package and thermal resistance information for mature  
Altera® devices. Package information includes the ordering code reference, package  
acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead  
coplanarity, weight, moisture sensitivity level, and other special information. The  
thermal resistance information includes device pin count, package name, and  
resistance values.  
This datasheet includes the following sections:  
“Device and Package Cross Reference” on page 1  
“Thermal Resistance” on page 23  
“Package Outlines” on page 44  
f
For more package and thermal resistance information about Altera devices that are  
not listed in this datasheet, refer to the Package and Thermal Resistance page of the  
Altera website.  
f
f
For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for  
Handling J-Lead, QFP, and BGA Devices.  
RoHS-compliant devices are compatible with leaded-reflow temperatures. For more  
information, refer to Altera’s RoHS-Compliant Devices literature page.  
Device and Package Cross Reference  
Table 2 through Table 22 lists the device, package type, and number of pins for each  
Altera device listed in this datasheet. Altera devices listed in this datasheet are  
available in the following packages:  
Ball-Grid Array (BGA)  
Ceramic Pin-Grid Array (PGA)  
FineLine BGA (FBGA)  
Hybrid FineLine BGA (HBGA)  
Plastic Dual In-Line Package (PDIP)  
Plastic Enhanced Quad Flat Pack (EQFP)  
Plastic J-Lead Chip Carrier (PLCC)  
Plastic Quad Flat Pack (PQFP)  
Power Quad Flat Pack (RQFP)  
Thin Quad Flat Pack (TQFP)  
Ultra FineLine BGA (UBGA)  
© December 2011 Altera Corporation  
Package Information Datasheet for Mature Altera Devices  

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