EMD4DXV6T1,
EMD4DXV6T5
Preferred Devices
Dual Bias Resistor
Transistors
NPN and PNP Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
http://onsemi.com
(3)
(2)
(1)
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the EMD4DXV6T1 series,
two complementary BRT devices are housed in the SOT−563 package
which is ideal for low power surface mount applications where board
space is at a premium.
R
1
R
2
Q
1
Q
2
R
2
R
1
(4)
(5)
(6)
Features
6
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• These are Pb−Free Devices
1
SOT−563
CASE 463A
STYLE 1
MAXIMUM RATINGS (T = 25°C unless otherwise noted, common for Q
A
1
and Q , − minus sign for Q (PNP) omitted)
2
1
MARKING DIAGRAM
Rating
Symbol
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
V
V
50
Vdc
CBO
CEO
50
Vdc
U7 M G
I
100
mAdc
C
G
1
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
U7 = Specific Device Code
Total Device Dissipation
P
357
2.9
mW
mW/°C
D
M
= Date Code
T = 25°C (Note 1)
Derate above 25°C (Note 1)
A
G
= Pb−Free Package
(Note: Microdot may be in either location)
Thermal Resistance,
R
q
JA
350
°C/W
Junction-to-Ambient (Note 1)
ORDERING INFORMATION
Total Device Dissipation
P
500
4.0
mW
mW/°C
†
D
Device
Package
Shipping
T = 25°C (Note 1)
A
Derate above 25°C
EMD4DXV6T1G
SOT−563 4000/Tape & Reel
(Pb−Free)
Thermal Resistance,
R
q
250
°C/W
JA
Junction-to-Ambient (Note 1)
EMD4DXV6T5G
SOT−563 8000/Tape & Reel
(Pb−Free)
Junction and Storage Temperature
T , T
J
−55 to +150
°C
stg
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. FR−4 board with minimum mounting pad.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
October, 2005− Rev. 1
EMD4DXV6/D