EMD1S
THRU
RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICATION
EMD4S
SINGLE-PHASE GLASS PASSIVATED
MINI SUPER FAST SURFACE MOUNT BRIDGE RECTIFIER
VOLTAGE RANGE 50 to 200 Volts CURRENT 0.5 Ampere
FEATURES
* Surge overload rating - 30 amperes peak
* Ideal for printed circuit board
* Reliable low cost construction utilizing molded
* Glass passivated device
* Polarity symbols molded on body
* Mounting position: Any
MD-S
* Weight: 0.5 gram
MECHANICAL DATA
1
2
3
4
*
Epoxy : Device has UL flammability classification 94V-0
M D
.004(0.10) MAX.
0.028(0.9)
0.020(0.5)
0.108(2.74)
0.092(2.34)
0.193(4.9)
0.177(4.5)
0.106(2.7)
0.091(2.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
0.014(0.35)
0.006(0.15)
0.193(4.9)
0.177(4.5)
Dimensions in millimeters
MAXIMUM RATINGS (At T
A
= 25oC unless otherwise noted)
RATINGS
SYMBOL
EMD1S
EMD2S
EMD3S
EMD4S
UNITS
Volts
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
V
RRM
RMS
50
35
50
100
70
150
105
150
200
140
200
V
Volts
Maximum DC Blocking Voltage
V
DC
Volts
Amp
100
Maximum Average Forward Output Rectified
= 30oC
- on glass-epoxy P.C.B. ( NOTE 1 )
0.5
0.8
Current at
T
A
I
O
- on aluminum substrate ( NOTE 2 )
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Typical Junction Capacitance ( Note 5 )
I
FSM
20
15
Amps
C
J
pF
0 C
Operating and Storage Temperature Range
T
J,
T
STG
-55 to + 150
ELECTRICAL CHARACTERISTICS (At TA
= 25oC unless otherwise noted)
CHARACTERISTICS
SYMBOL
UNITS
EMD1S
EMD2S
EMD3S
EMD4S
Maximum Forward Voltage Drop per Bridge Element at 0.5A DC
V
F
1.05
10
Volts
= 25oC
= 125oC
uAmps
Maximum Reverse Current at rated
DC Blocking Voltage per element
@T
@T
A
A
I
R
0.5
mAmps
Maximum Reverse Recovery Time (Note 4)
trr
50
nSec
2002-4
NOTE: 1. On glass-epoxy P.C.B. mounted on 0.05 X 0.05” (1.3 X 1.3mm) pads.
2. On aluminum substrate P.C.B. with an area of 0.8 X 0.8 X 0.25” (20 X 20 X 6.4mm) mounted on 0.05 X 0.05” (1.27 X 1.27mm) solder pad.
3. Suffix “-S” Surface Mount for Mini Dip Bridge.
4. Test Conditions: IF=0.5A, IR=-1.0A, IRR=-0.25A.
5. Measured at 1MHz and applied reverse voltage of 4.0 volts.