EMB2F THRU EMB8F
GLASS PASSIVATED SUPER FAST RECOVERY BRIDGE RECTIFIERS
Voltage Range - 200 to 600Volts Current -0.5/0.8 Ampere
MBF
FEATURES
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
0.276(7.00)
0.252(6.40)
0.059(1.50)
Max
High temperature soldering guaranteed:
260 / 10 seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
Leads solderable per MIL-STD-202,Method 208
High surge current capability
0.195(4.95)
0.177(4.50)
0.106 (2.70)
0.091 (2.30)
0.028(0.70)
0.020(0.50)
Super fast switching for high efficiency
Glass passivated chip junction
Green compound(halogen&Sb2O3 free)
0.161 (4.10)
0.142 (3.60)
MECHANICAL DATA
0.067(1.70)
0.051(1.30)
0.014 (0.35)
0.006(0.150)
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on case
Mounting Position: Any
0.043(1.10)
0.020(0.50)
0.008 (0.20)
Max
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.
SYMBOLS
UNITS
EMB2F
EMB4F
EMB6F
EMB8F
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
100
70
200
140
200
400
280
400
600
420
600
V
V
V
Maximum DC blocking voltage
Maximum average forward rectified current
On glass-epoxy P.C.B.(Note1)
On aluminum substrate(Note2)
Peak forward surge current,
100
IF(AV)
IFSM
0.5
0.8
A
30
8.3ms single half sine-wave superimposed on
rated load
A
V
Maximum instantaneous forward voltage drop
per leg at 0.4A
VF
IR
0.95
1.25
1.7
Maximum DC reverse current
at rated DC blocking voltage
TA=25
uA
uA
5.0
TA=125
500
Typical thermal resistance(NOTE 3)
R JL
R JA
trr
30
88
/W
ns
Maximum reverse recovery time
(NOTE 4)
35
Operating temperature range
storage temperature range
TJ
-55 to +150
-55 to +150
TSTG
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.
2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.
3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)
4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.
copper pads.
DN:S16F04A1
STAR SEA