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EM6AB160TSE-4G PDF预览

EM6AB160TSE-4G

更新时间: 2022-02-26 11:43:43
品牌 Logo 应用领域
钰创 - ETRON 动态存储器双倍数据速率
页数 文件大小 规格书
62页 560K
描述
32M x 16 bit DDR Synchronous DRAM

EM6AB160TSE-4G 数据手册

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EM6AB160  
EtronTech  
32M x 16 bit DDR Synchronous DRAM (SDRAM)  
Advance (Rev. 1.3, Jun. /2015)  
Overview  
Features  
The EM6AB160 SDRAM is a high-speed CMOS double  
data rate synchronous DRAM containing 512 Mbits. It is  
internally configured as a quad 8M x 16 DRAM with a  
synchronous interface (all signals are registered on the  
positive edge of the clock signal, CK). Data outputs  
Fast clock rate: 250/200MHz  
Differential Clock CK &  
Bi-directional DQS  
CK  
DLL enable/disable by EMRS  
Fully synchronous operation  
Internal pipeline architecture  
Four internal banks, 8M x 16-bit for each bank  
Programmable Mode and Extended Mode registers  
- CAS Latency: 2, 2.5, 3  
occur at both rising edges of CK and  
. Read and  
CK  
write accesses to the SDRAM are burst oriented;  
accesses start at a selected location and continue for a  
programmed number of locations in a programmed  
sequence. Accesses begin with the registration of a  
BankActivate command which is then followed by a  
Read or Write command. The EM6AB160 provides  
programmable Read or Write burst lengths of 2, 4, or 8.  
An auto precharge function may be enabled to provide  
a self-timed row precharge that is initiated at the end of  
the burst sequence. The refresh functions, either Auto  
or Self Refresh are easy to use. In addition, EM6AB160  
features programmable DLL option. By having a  
programmable mode register and extended mode  
register, the system can choose the most suitable  
modes to maximize its performance. These devices are  
well suited for applications requiring high memory  
bandwidth, result in a device particularly well suited to  
high performance main memory and graphics  
applications.  
- Burst length: 2, 4, 8  
- Burst Type: Sequential & Interleaved  
Individual byte write mask control  
DM Write Latency = 0  
Auto Refresh and Self Refresh  
8192 refresh cycles / 64ms  
Precharge & active power down  
±
Power supplies: VDD & VDDQ = 2.5V 0.2V  
Operating Temperature: T = 0~70°C  
A
Interface: SSTL_2 I/O Interface  
Package: 66 Pin TSOP II, 0.65mm pin pitch  
- Pb and Halogen free  
Package: 60-Ball, 8x13x1.2 mm (max) FBGA  
- Pb free and Halogen Free  
Table 1. Ordering Information  
Part Number  
Clock Frequency  
Data Rate  
Package  
EM6AB160TSE-4G  
EM6AB160TSE-5G  
250MHz  
200MHz  
250MHz  
200MHz  
500Mbps/pin  
400Mbps/pin  
500Mbps/pin  
400Mbps/pin  
TSOPII  
TSOPII  
FBGA  
EM6AB160WKE-4H  
EM6AB160WKE-5H  
FBGA  
TS : indicates TSOPII package  
WK: indicates 8x13x1.2 mm FBGA package  
E: indicates Generation Code  
G: indicates Pb and Halogen free for TSOPII Package  
H: indicates Pb and Halogen free for FBGA Package  
Etron Technology, Inc.  
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.  
TEL: (886)-3-5782345 FAX: (886)-3-5778671  
Etron Technology, Inc. reserves the right to change products or specification without notice.  

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