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EM68C16CWQE-3H PDF预览

EM68C16CWQE-3H

更新时间: 2022-02-26 12:34:35
品牌 Logo 应用领域
钰创 - ETRON 动态存储器双倍数据速率
页数 文件大小 规格书
58页 1298K
描述
64M x 16 bit DDRII Synchronous DRAM (SDRAM)

EM68C16CWQE-3H 数据手册

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EtronTech  
EM68C16CWQE  
64M x 16 bit DDRII Synchronous DRAM (SDRAM)  
Advance (Rev. 1.6, May /2016)  
Features  
Overview  
JEDEC Standard Compliant  
JEDEC standard 1.8V I/O (SSTL_18-compatible)  
Power supplies: VDD & VDDQ = +1.8V 0.1V  
The EM68C16C is a high-speed CMOS Double-  
Data-Rate-Two (DDR2), synchronous dynamic random  
- access memory (SDRAM) containing 1024 Mbits in a  
16-bit wide data I/Os. It is internally configured as a 8-  
bank DRAM, 8 banks x 8Mb addresses x 16 I/Os. The  
device is designed to comply with DDR2 DRAM key  
features such as posted CAS# with additive latency,  
Write latency = Read latency -1, Off-Chip Driver (OCD)  
impedance adjustment, and On Die Termination(ODT).  
All of the control and address inputs are synchronized  
with a pair of externally supplied differential clocks.  
Inputs are latched at the cross point of differential clocks  
(CK rising and CK# falling). All I/Os are synchronized  
with a pair of bidirectional strobes (DQS and DQS#) in  
a source synchronous fashion. The address bus is used  
to convey row, column, and bank address information  
in RAS #, CAS# multiplexing style. Accesses begin with  
the registration of a Bank Activate command, and then  
it is followed by a Read or Write command. Read and  
write accesses to the DDR2 SDRAM are 4 or 8-bit burst  
oriented; accesses start at a selected location and  
continue for a programmed number of locations in a  
programmed sequence. Operating the eight memory  
banks in an interleaved fashion allows random access  
operation to occur at a higher rate than is possible with  
standard DRAMs. An auto precharge function may be  
enabled to provide a self-timed row precharge that is  
initiated at the end of the burst sequence. A sequential  
and gapless data rate is possible depending on burst  
length, CAS latency, and speed grade of the device.  
Operating temperature: T = 0~85 C  
°
C
Supports JEDEC clock jitter specification  
Fully synchronous operation  
Fast clock rate: 333/400/533 MHz  
Differential Clock, CK & CK#  
Bidirectional single/differential data strobe  
- DQS & DQS#  
8 internal banks for concurrent operation  
4-bit prefetch architecture  
Internal pipeline architecture  
Precharge & active power down  
Programmable Mode & Extended Mode registers  
Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6  
WRITE latency = READ latency - 1 t  
Burst lengths: 4 or 8  
Burst type: Sequential / Interleave  
DLL enable/disable  
Off-Chip Driver (OCD)  
CK  
- Impedance Adjustment  
- Adjustable data-output drive strength  
On-die termination (ODT)  
RoHS compliant  
Auto Refresh and Self Refresh  
8192 refresh cycles / 64ms  
84-ball 8 x 12.5 x 1.2mm (max) FBGA package  
- Pb and Halogen Free  
Table 1. Ordering Information  
Part Number  
Clock Frequency  
Data Rate  
1066Mbps/pin  
800Mbps/pin  
667Mbps/pin  
Power Supply  
Package  
FBGA  
EM68C16CWQE-18H  
EM68C16CWQE-25H  
EM68C16CWQE-3H  
533MHz  
400MHz  
333MHz  
V
V
V
1.8V, V  
1.8V, V  
1.8V, V  
1.8V  
1.8V  
1.8V  
DD  
DD  
DD  
DDQ  
DDQ  
DDQ  
FBGA  
FBGA  
WQ: indicates 8 x 12.5 x 1.2mm FBGA Package  
E: indicates Generation Code  
H: indicates Pb and Halogen Free  
Etron Technology, Inc.  
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.  
TEL: (886)-3-5782345  
FAX: (886)-3-5778671  
Etron Technology, Inc. reserves the right to change products or specification without notice.  

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