EtronTech
EM68C16CWQE
64M x 16 bit DDRII Synchronous DRAM (SDRAM)
Advance (Rev. 1.6, May /2016)
Features
Overview
JEDEC Standard Compliant
JEDEC standard 1.8V I/O (SSTL_18-compatible)
Power supplies: VDD & VDDQ = +1.8V 0.1V
The EM68C16C is a high-speed CMOS Double-
Data-Rate-Two (DDR2), synchronous dynamic random
- access memory (SDRAM) containing 1024 Mbits in a
16-bit wide data I/Os. It is internally configured as a 8-
bank DRAM, 8 banks x 8Mb addresses x 16 I/Os. The
device is designed to comply with DDR2 DRAM key
features such as posted CAS# with additive latency,
Write latency = Read latency -1, Off-Chip Driver (OCD)
impedance adjustment, and On Die Termination(ODT).
All of the control and address inputs are synchronized
with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks
(CK rising and CK# falling). All I/Os are synchronized
with a pair of bidirectional strobes (DQS and DQS#) in
a source synchronous fashion. The address bus is used
to convey row, column, and bank address information
in RAS #, CAS# multiplexing style. Accesses begin with
the registration of a Bank Activate command, and then
it is followed by a Read or Write command. Read and
write accesses to the DDR2 SDRAM are 4 or 8-bit burst
oriented; accesses start at a selected location and
continue for a programmed number of locations in a
programmed sequence. Operating the eight memory
banks in an interleaved fashion allows random access
operation to occur at a higher rate than is possible with
standard DRAMs. An auto precharge function may be
enabled to provide a self-timed row precharge that is
initiated at the end of the burst sequence. A sequential
and gapless data rate is possible depending on burst
length, CAS latency, and speed grade of the device.
Operating temperature: T = 0~85 C
°
C
Supports JEDEC clock jitter specification
Fully synchronous operation
Fast clock rate: 333/400/533 MHz
Differential Clock, CK & CK#
Bidirectional single/differential data strobe
- DQS & DQS#
8 internal banks for concurrent operation
4-bit prefetch architecture
Internal pipeline architecture
Precharge & active power down
Programmable Mode & Extended Mode registers
Posted CAS# additive latency (AL): 0, 1, 2, 3, 4, 5, 6
WRITE latency = READ latency - 1 t
Burst lengths: 4 or 8
Burst type: Sequential / Interleave
DLL enable/disable
Off-Chip Driver (OCD)
CK
- Impedance Adjustment
- Adjustable data-output drive strength
On-die termination (ODT)
RoHS compliant
Auto Refresh and Self Refresh
8192 refresh cycles / 64ms
84-ball 8 x 12.5 x 1.2mm (max) FBGA package
- Pb and Halogen Free
Table 1. Ordering Information
Part Number
Clock Frequency
Data Rate
1066Mbps/pin
800Mbps/pin
667Mbps/pin
Power Supply
Package
FBGA
EM68C16CWQE-18H
EM68C16CWQE-25H
EM68C16CWQE-3H
533MHz
400MHz
333MHz
V
V
V
1.8V, V
1.8V, V
1.8V, V
1.8V
1.8V
1.8V
DD
DD
DD
DDQ
DDQ
DDQ
FBGA
FBGA
WQ: indicates 8 x 12.5 x 1.2mm FBGA Package
E: indicates Generation Code
H: indicates Pb and Halogen Free
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345
FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.