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ELJSC470KF PDF预览

ELJSC470KF

更新时间: 2024-01-22 00:54:52
品牌 Logo 应用领域
松下 - PANASONIC 电感器固定电感器
页数 文件大小 规格书
3页 109K
描述
Fixed Inductors (Chip Inductors)

ELJSC470KF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:CHIP, 1008, ROHS COMPLIANT
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.82
Is Samacsys:NBase Number Matches:1

ELJSC470KF 数据手册

 浏览型号ELJSC470KF的Datasheet PDF文件第2页浏览型号ELJSC470KF的Datasheet PDF文件第3页 
Fixed Inductors (Chip Inductors)  
5. Shielded Type SC, SA  
Features  
Magnetic shield effect using ferrite mixed within outer molding.  
Capable of being Re-flow or flow soldered.  
Good for mounting.  
Recommended Applications  
AV equipment, Wireless communication equipment and various types of general electronic equipment.  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
E
L
J
S
A
1
R
5
K
F
Packaging Design No.  
Product code  
Chip Inductors  
Shape  
Inductance  
Inductance tolerance  
10 %  
F
Taping  
SC 2520 (1008)  
SA 3225 (1210)  
Size : mm (inch)  
100  
470  
271  
10 µH  
47 µH  
K
270 µH  
Storage Conditions  
Package  
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to  
direct sunlight and harmful gases and care should be taken so as not to cause dew.  
Operating Temperature : –20 to +85 °C  
Storage Period  
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation  
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the  
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.  
Refer 27 and 28 page.  
Refer 29 page.  
Packaging  
Soldering Conditions  
Safety Precautions  
Refer 30 page.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Jul. 2008  

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