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ELJNC10NMZFB PDF预览

ELJNC10NMZFB

更新时间: 2024-02-15 12:31:18
品牌 Logo 应用领域
松下 - PANASONIC /
页数 文件大小 规格书
5页 92K
描述
1. High Frequency Use (Non Magnetic Core) RF, ND, NC, NA

ELJNC10NMZFB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.68型芯材料:AIR
直流电阻:0.32 Ω标称电感 (L):0.01 µH
电感器应用:RF INDUCTOR电感器类型:GENERAL PURPOSE INDUCTOR
JESD-609代码:e2功能数量:1
端子数量:2最小质量因数(标称电感时):10
最大额定电流:0.28 A自谐振频率:2500 MHz
形状/尺寸说明:RECTANGULAR PACKAGE屏蔽:NO
表面贴装:YES端子面层:Tin/Copper (Sn/Cu)
端子位置:DUAL ENDED端子形状:J BEND
测试频率:100 MHz容差:20%
Base Number Matches:1

ELJNC10NMZFB 数据手册

 浏览型号ELJNC10NMZFB的Datasheet PDF文件第2页浏览型号ELJNC10NMZFB的Datasheet PDF文件第3页浏览型号ELJNC10NMZFB的Datasheet PDF文件第4页浏览型号ELJNC10NMZFB的Datasheet PDF文件第5页 
Fixed Inductors (Chip Inductors)  
1. High Frequency Use (Non Magnetic Core) RF, ND, NC, NA  
Japan  
China  
Features  
High Freq. use chip inductor using non magnetic core.  
Corespond to Re-owsoldering and ow soldering.  
Wide line-up from 1005 size to 3225 size.  
Good for mounting.  
Recommended Applications  
RF circuit for cellular phone and wireless communication equipment.  
Explanation of Part Numbers  
E
L
J
R
F
1
0
N
J
F
B
Packaging Design No.  
F
Product code  
Chip Inductors  
Shape  
Inductance  
Inductance tolerance  
Taping  
RF  
1005  
2012  
2520  
3225  
1N5  
10N  
R22  
3R3  
470  
561  
1.5 nH  
10 nH  
Z
0.2 nH  
0.3 nH  
0.5 nH  
2 %  
ND  
NC  
NA  
D
E
220 nH  
3.3 µH  
47 µH  
G
A
J
3 %  
560 µH  
5 %  
102 1000 µH  
K
M
10 %  
20 %  
Storage condition  
Package  
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH Max.), shall not be exposed to  
direct sunlight and harmful gas and care should be taken so as not to cause dew.  
Product on PWB: Temperature –20 to +85 °C  
Storage period  
In generally, even if storage condition is good, solderability will be down cause of time progress.  
Please use product within 6 months after received.  
(In case of over 6 months storage period, use the product after conrmation of no abnormality of appearance and  
solderability.)  
Refer 28 ro 29 page.  
Refer 30 page.  
Packaging  
Soldering condition  
Caution for use  
Refer 31 page.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  

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