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ELANSC410-33AC PDF预览

ELANSC410-33AC

更新时间: 2024-02-15 21:08:23
品牌 Logo 应用领域
超微 - AMD 微控制器外围集成电路PC时钟
页数 文件大小 规格书
132页 2249K
描述
Single-Chip, Low-Power, PC/AT-Compatible Microcontrollers

ELANSC410-33AC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA292,20X20,50
针数:292Reach Compliance Code:unknown
HTS代码:8542.31.00.01风险等级:5.87
Is Samacsys:N具有ADC:NO
地址总线宽度:26位大小:32
最大时钟频率:0.032 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:32
JESD-30 代码:S-PBGA-B292JESD-609代码:e0
长度:27 mmI/O 线路数量:32
端子数量:292最高工作温度:70 °C
最低工作温度:PWM 通道:NO
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA292,20X20,50封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
ROM可编程性:FLASH座面最大高度:2.61 mm
速度:33 MHz子类别:Microprocessors
最大供电电压:3.6 V最小供电电压:2.7 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

ELANSC410-33AC 数据手册

 浏览型号ELANSC410-33AC的Datasheet PDF文件第2页浏览型号ELANSC410-33AC的Datasheet PDF文件第3页浏览型号ELANSC410-33AC的Datasheet PDF文件第4页浏览型号ELANSC410-33AC的Datasheet PDF文件第5页浏览型号ELANSC410-33AC的Datasheet PDF文件第6页浏览型号ELANSC410-33AC的Datasheet PDF文件第7页 
Élan™SC400 and ÉlanSC410  
Single-Chip, Low-Power,  
PC/AT-Compatible Microcontrollers  
Standard PC/AT system logic  
DISTINCTIVE CHARACTERISTICS  
(PICs, DMACs, timer, RTC)  
Élan™SC400 and ÉlanSC410  
Microcontrollers  
E86TM family of x86 embedded processors  
– DOS, ROM-DOS, Windows, and industry-  
standard BIOS support  
– Leverages the benefits of desktop computing  
environment at embedded price points  
– Offers improved time-to-market, software  
migration, and field-proven development tools  
Bidirectional parallel port with Enhanced  
Highly integrated single-chip CPU with a complete  
Parallel Port (EPP) mode  
set of common peripherals  
16550-compatible UART  
Infrared port for wireless communication  
– Standard and high-speed  
– Accelerates time-to-market with simplified  
hardware  
– Low-power 0.35-micron process technology  
– Single chip delivers smallest system form factor  
Keyboard interface  
– Matrix keyboard support with up to 15 rows and 8  
columns  
– 33-MHz, 66-MHz, and 100-MHz operating  
frequencies  
– SCP-emulation mode for PC/AT and XT  
keyboard support  
Am486® CPU core  
– Robust Microsoft® Windows® compatible CPU  
ÉlanSC400 Microcontroller Only  
– 8-Kbyte write-back cache for enhanced  
performance  
The ÉlanSC400 microcontroller includes the following  
additional features designed specifically for mobile  
computing applications. The ÉlanSC410 microcontrol-  
ler does not include these features.  
– Fully static design with System Management  
Mode (SMM) for power savings  
Comprehensive power management unit  
Dual PC Card (PCMCIA Version 2.1) controller  
– Seven modes of operation allow fine-tuning of  
power requirements for maximum battery life  
supports 8- or 16-bit data bus  
– End-user (after-market) system expansion  
– ExCA-compliant, 82365-register set compatible  
– Leverages off-the-shelf card and socket services  
– Provides a superset of APM 1.2 features  
Glueless burst-mode  
ROM/Flash memory/SRAM interface  
– Supports DMA transfers between I/O PC cards  
and system DRAM  
– Reduces system cost by allowing mask ROM and  
Flash memory at the same time with three ROM/  
Flash memory/SRAM chip selects  
LCD graphics controller  
– Supports monochrome and 4-bit color Super  
Twisted Nematic (STN) LCDs  
Glueless DRAM controller  
– Allows mixed DRAM types on a per-bank basis to  
reduce system cost  
– Unified Memory Architecture (UMA) eliminates  
separate video memory  
VESA Local (VL) bus and ISA bus interface  
– Reduces time-to-market with a wide variety of off-  
the-shelf companion chips  
© Copyright 1998 Advanced Micro Devices, Inc. All Rights Reserved.  
Advanced Micro Devices, Inc. (“AMD”) reserves the right to discontinue its products, or make changes in its products, at any time without notice.  
The information in this publication is believed to be accurate at the time of publication, but AMD makes no representations or warranties with respect to the accuracy or completeness of the  
contents of this publication or the information contained herein, and reserves the right to make changes at any time, without notice. AMD disclaims responsibility for any consequences resulting  
from the use of the information included in this publication.  
This publication neither states nor implies any representations or warranties of any kind, including but not limited to, any implied warranty of merchantability or fitness for a particular purpose.  
AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support  
or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury,  
death, or severe property or environmental damage may occur. AMD assumes no liability whatsoever for claims associated with  
the sale or use (including the use of engineering samples) of AMD products except as provided in AMD’s Terms and Conditions  
of Sale for such product.  
Publication# 21028 Rev: B Amendment/0  
Issue Date: December 1998  

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