EGP10A thru EGP10G
Vishay General Semiconductor
Glass Passivated Ultrafast Rectifier
FEATURES
• Cavity-free glass-passivated junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low leakage current
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 260 °C, 40 s
*Glass Encapsulation
technique is covered by
Patent No. 3,996,602,
brazed-lead assembly
to Patent No. 3,930,306
DO-204AL (DO-41)
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in high frequency rectification and
freewheeling application in switching mode converters
and inverters for consumer, computer and
telecommunication.
PRIMARY CHARACTERISTICS
IF(AV)
1.0 A
VRRM
IFSM
trr
50 V to 200 V
30 A
MECHANICAL DATA
Case: DO-204AL, molded epoxy over glass body
50 ns
Epoxy meets UL 94V-0 flammability rating
VF
0.95 V, 1.25 V
150 °C
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
TJ max.
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test, HE3 suffix for high reliability grade
(AEC Q101 qualified), meets JESD 201 class 2
whisker test
Polarity: Color band denotes cathode end
MAXIMUM RATINGS T = 25 °C unless otherwise noted
A
PARAMETER
SYMBOL EGP10A EGP10B EGP10C EGP10D EGP10F EGP10G
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
50
35
50
100
70
150
105
150
200
140
200
300
210
300
400
280
400
V
V
V
Maximum DC blocking voltage
100
Maximum average forward rectified current
0.375" (9.5 mm) lead length at TA = 55 °C
IF(AV)
1.0
30
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
A
Operating and storage temperature range
TJ, TSTG
- 65 to + 150
°C
Document Number: 88582
Revision: 20-Aug-07
For technical questions within your region, please contact one of the following:
PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
www.vishay.com
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