EGL341A-EGL341J
Surface Mount Rectifiers
VOLTAGE RANGE: 50 --- 600 V
CURRENT: 1.0 A
Features
DO - 213AA
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Plastic package has underwriters laboratories
flammability classification 94V-0
SOLDERABLE ENDS
+0
D2=D1
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Glass passivated chip junction
-0.20
For surface mount applications
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
D2
High temperature soldering guaranteed:450℃/5 seconds
at terminals.Complete device sub-mersible temperature
of 265℃ for 10 seconds in solder bath
0.5± 0.1
0.5± 0.1
3.5± 0.2
Mechanical Data
Dimensions in millimeters
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Case: JEDEC DO-213AA,molded plastic
Polarity: Color band denotes cathode
Weight: 0.0014 ounces, 0.036 grams
Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.
EGL
341A
50
EGL EGL EGL EGL EGL EGL
341B 341D 341F 341G 341H 341J
UNITS
VRRM
VRMS
VDC
Maximum recurrent peak reverse voltage
Maximum RMS voltage
100 200 300 400 500
70
V
V
V
600
35
140 210 280 350 420
Maximum DC blocking voltage
Maximum average forward rectified current
TT=75℃
50
100 200 300 400 500
600
I(AV)
1.0
A
Peak forward surge current
IFSM
8.3ms single half-sine-wave
30
A
superimposed on rated load (JEDEC Method)
VF
IR
Maximum instantaneous forward voltage @1.0A
1.25
1.35
1.70
V
Maximum reverse current
@TA=25℃
5.0
50
50
15
µA
at rated DC blocking voltage @TA=125℃
Maximum reverse recovery time (Note 1)
Typical junction capacitance (Note 2)
Typical thermal resistance (Note 3)
trr
Cj
ns
pF
RθJA
Tj
TSTG
150
K/W
℃
Operating junction temperature range
- 55 ---- +175
- 55 ---- +175
Storage temperature range
℃
NOTE: 1. Measured with IF=0.5A,IR=1.0A,Irr=0.25A
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Thermal resistance from junction to ambient, 0.24×0.24"(6.0×6.0mm) copper pads to each terminal.
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